18498519. DOUBLE-SIDED CONDUCTIVE VIA (Intel Corporation)
DOUBLE-SIDED CONDUCTIVE VIA
Organization Name
Inventor(s)
Mandip Sibakoti of Hillsboro OR US
Bozidar Marinkovic of Portland OR US
Tofizur Rahman of Portland OR US
Conor P. Puls of Portland OR US
DOUBLE-SIDED CONDUCTIVE VIA
This abstract first appeared for US patent application 18498519 titled 'DOUBLE-SIDED CONDUCTIVE VIA
Original Abstract Submitted
A fabrication method and associated integrated circuit (IC) structures and devices that include one or more conductive vias is described herein. In one example, a conductive via is formed from one side of the integrated circuit, and then a portion of the conductive via is widened from a second side of the IC structure opposite the first side. In one example, a resulting IC structure includes a first portion having a first width, a second portion having a second width, and a third portion having a third width, wherein the third portion is between the first portion and the second portion, and the third width is smaller than the first width and the second width. In one such example, the conductive via tapers from both ends towards the third portion between the ends.