Category:Nicholas S. Haehn of Scottsdale AZ US
Nicholas S. Haehn
Nicholas S. Haehn from Scottsdale AZ US has applied for patents in technology areas such as H05K1/02, H01L21/48, H01L23/15 with intel corporation.
Patents
Pages in category "Nicholas S. Haehn of Scottsdale AZ US"
The following 11 pages are in this category, out of 11 total.
1
- 18372585. NANOTWIN LINER FOR THROUGH GLASS VIAS (Intel Corporation)
- 18374609. STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES (INTEL CORPORATION)
- 18374617. THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION (INTEL CORPORATION)
- 18374932. CONTROLLING SUBSTRATE BUMP HEIGHT (INTEL CORPORATION)
- 18374937. GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS (INTEL CORPORATION)
I
- Intel corporation (20240258183). PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Intel corporation (20250106982). NANOTWIN LINER FOR THROUGH GLASS VIAS
- Intel corporation (20250112136). GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Intel corporation (20250112140). STRESS MITIGATION ARCHITECTURES FOR GLASS CORE SUBSTRATES
- Intel corporation (20250112164). CONTROLLING SUBSTRATE BUMP HEIGHT
- Intel corporation (20250113434). THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION