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Category:Robert Alan May of Chandler AZ (US)
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Pages in category "Robert Alan May of Chandler AZ (US)"
The following 14 pages are in this category, out of 14 total.
1
- 17847434. PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17932624. MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNECTS HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
- 17937894. ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract (Intel Corporation)
- 17956750. NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS simplified abstract (Intel Corporation)
- 17957600. HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17958002. MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract (Intel Corporation)
- 18392368. EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING simplified abstract (Intel Corporation)
- 18511641. PATCH ACCOMMODATING EMBEDDED DIES HAVING DIFFERENT THICKNESSES simplified abstract (Intel Corporation)
I
- Intel corporation (20240105621). DIE INTERCONNECT SUBSTRATE, AN ELECTRICAL DEVICE AND A METHOD FOR FORMING A DIE INTERCONNECT SUBSTRATE simplified abstract
- Intel corporation (20240111089). NANOROD COATING BETWEEN TWO OPTICAL MEDIUMS simplified abstract
- Intel corporation (20240111095). HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract
- Intel corporation (20240112972). MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract
- Intel corporation (20240114627). ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract
- Intel corporation (20240128138). EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING simplified abstract