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Category:H01L25/07
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Pages in category "H01L25/07"
The following 21 pages are in this category, out of 21 total.
1
- 17460324. MEMORY ARRAY, INTEGRATED CIRCUIT INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17529115. NANOSHEET REPLACEMENT METAL GATE PATTERNING SCHEME simplified abstract (International Business Machines Corporation)
- 18051141. CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18134437. POWER MODULE simplified abstract (Hyundai Motor Company)
- 18134437. POWER MODULE simplified abstract (Kia Corporation)
- 18334304. SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18453991. POWER SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18468362. PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
B
D
- Delphi technologies ip limited (20240105553). SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS simplified abstract
- Delphi technologies ip limited (20240105684). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
- Delphi technologies ip limited (20240106338). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
- Delphi technologies ip limited (20240107675). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract