18134437. POWER MODULE simplified abstract (Kia Corporation)
Contents
POWER MODULE
Organization Name
Inventor(s)
So Eun Jeong of Hwaseong-Si (KR)
Jun Hee Park of Hwaseong-Si (KR)
Nam Sik Kong of Hwaseong-Si (KR)
POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18134437 titled 'POWER MODULE
Simplified Explanation
The patent application describes a power module with upper and lower substrates, upper and lower chips, and a circuit board connecting the chips to the substrates.
- Upper and lower substrates are vertically spaced from each other.
- Circuit board connects upper chip to lower substrate and lower chip to upper substrate.
Potential Applications
The technology could be applied in various power electronics systems, such as inverters, converters, and motor drives.
Problems Solved
The power module design helps in efficient power distribution and thermal management in electronic devices.
Benefits
The vertical spacing of substrates reduces interference and improves overall performance and reliability of the power module.
Potential Commercial Applications
"Power Module Design for Enhanced Performance and Reliability"
Possible Prior Art
There may be prior art related to power module designs with vertical substrate spacing and chip-to-substrate connections.
Unanswered Questions
How does this power module design compare to traditional power module configurations in terms of efficiency and reliability?
The article does not provide a direct comparison between this innovative power module design and traditional configurations. Further research or testing may be needed to determine the specific advantages of this design over existing ones.
What specific electronic devices or industries could benefit the most from implementing this power module technology?
The article does not specify the targeted electronic devices or industries that could benefit the most from this technology. Additional market research or case studies may be necessary to identify the ideal applications for this power module design.
Original Abstract Submitted
A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.
