18134437. POWER MODULE simplified abstract (Hyundai Motor Company)
Contents
POWER MODULE
Organization Name
Inventor(s)
So Eun Jeong of Hwaseong-Si (KR)
Jun Hee Park of Hwaseong-Si (KR)
Nam Sik Kong of Hwaseong-Si (KR)
POWER MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18134437 titled 'POWER MODULE
Simplified Explanation
The power module described in the patent application consists of an upper substrate, a lower substrate, an upper chip, a lower chip, and a circuit board that connects the chips to the substrates. The upper and lower substrates are vertically spaced from each other, with the circuit board facilitating electrical connections between the chips and substrates.
- Upper and lower substrates are vertically spaced from each other.
- Circuit board connects upper chip to lower substrate and lower chip to upper substrate.
Potential Applications
The technology described in this patent application could be applied in various industries such as electronics, automotive, renewable energy, and telecommunications.
Problems Solved
This technology solves the problem of efficiently connecting chips to substrates in a power module while maintaining a vertical spacing between the substrates.
Benefits
The benefits of this technology include improved electrical connections, compact design, and enhanced performance of the power module.
Potential Commercial Applications
The technology could be commercialized for use in power converters, motor drives, solar inverters, and other electronic devices.
Possible Prior Art
Prior art in the field of power modules may include similar designs with vertically spaced substrates and circuit boards for connecting chips. However, the specific configuration and features of this technology may distinguish it from existing solutions.
Unanswered Questions
How does this technology compare to existing power module designs in terms of efficiency and performance?
This article does not provide a direct comparison between this technology and existing power module designs in terms of efficiency and performance. Further research or testing may be needed to evaluate the advantages of this innovation over current solutions.
What are the potential challenges or limitations of implementing this technology in practical applications?
The article does not address potential challenges or limitations that may arise when implementing this technology in practical applications. Factors such as cost, compatibility with existing systems, and manufacturing processes could impact the adoption of this innovation.
Original Abstract Submitted
A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.
