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Category:H01L23/60
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Pages in category "H01L23/60"
The following 13 pages are in this category, out of 13 total.
1
- 17386278. SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES simplified abstract (QUALCOMM Incorporated)
- 17622792. ELECTROSTATIC PROTECTION CIRCUIT, POWER MANAGEMENT CHIP, AND DISPLAY TERMINAL simplified abstract (TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.)
- 17950175. SEMICONDUCTOR DEVICE WITH IMPROVED ESD PERFORMANCE, ESD RELIABILITY AND SUBSTRATE EMBEDDED POWERGRID APPROACH simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18149855. SOLID STATE DRIVE APPARATUS INCLUDING ELECTROSTATIC PREVENTION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18151059. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18165182. DISPLAY DEVICE AND ELECTRONIC DEVICE HAVING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)
T
- Taiwan semiconductor manufacturing company, ltd. (20240105644). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113159). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 4th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. patent applications on February 1st, 2024