18149855. SOLID STATE DRIVE APPARATUS INCLUDING ELECTROSTATIC PREVENTION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SOLID STATE DRIVE APPARATUS INCLUDING ELECTROSTATIC PREVENTION STRUCTURE
Organization Name
Inventor(s)
SOLID STATE DRIVE APPARATUS INCLUDING ELECTROSTATIC PREVENTION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18149855 titled 'SOLID STATE DRIVE APPARATUS INCLUDING ELECTROSTATIC PREVENTION STRUCTURE
Simplified Explanation
The abstract describes a solid state drive apparatus that includes a case, an electrostatic prevention structure, a package substrate module, and a cover.
- The apparatus includes a case with a base and side walls.
- An electrostatic prevention structure made of a metal pillar is present in the case.
- The metal pillar is spaced apart from the side walls and protrudes from the base.
- An electrostatic absorbing member is located on the metal pillar.
- A package substrate module is mounted on the electrostatic prevention structure.
- A cover is used to cover the case and the package substrate module.
Potential applications of this technology:
- Data storage devices, such as solid state drives (SSDs).
- Electronics and computer systems that require protection against electrostatic discharge.
Problems solved by this technology:
- Electrostatic discharge can damage electronic components, leading to data loss or device malfunction.
- The electrostatic prevention structure and electrostatic absorbing member help to prevent electrostatic discharge and protect the components.
Benefits of this technology:
- Enhanced protection against electrostatic discharge.
- Improved reliability and durability of data storage devices.
- Reduced risk of data loss or device failure due to electrostatic discharge.
Original Abstract Submitted
A solid state drive apparatus includes a case including a base and side walls extending upward along a circumference of the base, an electrostatic prevention structure of a metal pillar spaced apart from the side walls and protruding from at least a partial surface of the base and an electrostatic absorbing member on at least a partial surface of the metal pillar, a package substrate module mounted on the electrostatic prevention structure in the case, and a cover covering the case and the package substrate module.
