17950175. SEMICONDUCTOR DEVICE WITH IMPROVED ESD PERFORMANCE, ESD RELIABILITY AND SUBSTRATE EMBEDDED POWERGRID APPROACH simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR DEVICE WITH IMPROVED ESD PERFORMANCE, ESD RELIABILITY AND SUBSTRATE EMBEDDED POWERGRID APPROACH

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Aruldas Divakaran of Bengaluru (IN)

Subramanian Narasimhamoorthy of Bengaluru (IN)

Mallikarjungouda S Patil of Bengaluru (IN)

SEMICONDUCTOR DEVICE WITH IMPROVED ESD PERFORMANCE, ESD RELIABILITY AND SUBSTRATE EMBEDDED POWERGRID APPROACH - A simplified explanation of the abstract

This abstract first appeared for US patent application 17950175 titled 'SEMICONDUCTOR DEVICE WITH IMPROVED ESD PERFORMANCE, ESD RELIABILITY AND SUBSTRATE EMBEDDED POWERGRID APPROACH

Simplified Explanation

The abstract describes a semiconductor device that includes a substrate, metal rails embedded in the substrate, and a power grid also embedded in the substrate. One or more of the metal rails are part of the power grid and are directly connected to the substrate to control Electrostatic Discharge (ESD) in the semiconductor device.

  • The semiconductor device includes metal rails embedded in the substrate.
  • The metal rails are part of a power grid embedded in the substrate.
  • At least one metal rail is directly connected to the substrate to control ESD.
  • The purpose of the invention is to provide ESD protection in semiconductor devices.

Potential Applications

  • Semiconductor manufacturing industry
  • Electronics industry
  • Integrated circuit design and production

Problems Solved

  • Electrostatic Discharge (ESD) protection in semiconductor devices
  • Prevention of damage caused by ESD events
  • Enhancing the reliability and lifespan of semiconductor devices

Benefits

  • Improved ESD protection for semiconductor devices
  • Increased reliability and durability of semiconductor devices
  • Reduction in damage caused by ESD events
  • Enhanced performance and functionality of semiconductor devices


Original Abstract Submitted

A semiconductor device includes a substrate, a plurality of metal rails embedded in the substrate, and a power grid embedded in the substrate, at least one of the plurality of metal rails being part of the power grid and being directly connected to the substrate to control an Electrostatic Discharge (ESD) in the semiconductor device.