17386278. SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES simplified abstract (QUALCOMM Incorporated)
SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES
Organization Name
Inventor(s)
Aniket Patil of San Diego CA (US)
Hong Bok We of San Diego CA (US)
Abdolreza Langari of San Diego CA (US)
Lisha Zhang of San Diego CA (US)
SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17386278 titled 'SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES
Simplified Explanation
The abstract describes a semiconductor device that includes a substrate with various components such as a conductive paste column, a resin sheath, a ground shield, and multiple sense lines. The resin used in the device is a dielectric material.
- The semiconductor device includes a conductive paste column that passes through multiple metal layers.
- The conductive paste column is surrounded by a resin sheath.
- A ground shield surrounds the resin sheath.
- The device also includes multiple sense lines, including one connected to the conductive paste column and another connected to the ground shield.
- The resin used in the device is a dielectric material.
Potential Applications
- This semiconductor device can be used in various electronic devices such as smartphones, tablets, and computers.
- It can be utilized in the manufacturing of integrated circuits and other semiconductor components.
Problems Solved
- The device solves the problem of providing a conductive path through multiple metal layers in a semiconductor.
- It addresses the need for a dielectric material to surround the conductive path and provide insulation.
Benefits
- The use of a conductive paste column and resin sheath allows for efficient electrical conduction through multiple metal layers.
- The ground shield and sense lines provide effective grounding and sensing capabilities.
- The dielectric resin material ensures proper insulation and protection of the conductive path.
Original Abstract Submitted
In an aspect, a semiconductor includes a substrate. The substrate includes a column comprising a conductive paste that passes through a plurality of metal layers, a resin sheath surrounding the column, a ground shield surrounding the resin sheath, and a plurality of sense lines. The plurality of sense lines include a first sense line that is connected to the column comprising the conductive paste and a second sense line that is connected to the ground shield. The resin comprises a dielectric material.
