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Category:Aniket Patil of San Diego CA (US)
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Pages in category "Aniket Patil of San Diego CA (US)"
The following 10 pages are in this category, out of 10 total.
1
- 17386278. SENSE LINES FOR HIGH-SPEED APPLICATION PACKAGES simplified abstract (QUALCOMM Incorporated)
- 17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17455576. RECESS STRUCTURE FOR PADLESS STACK VIA simplified abstract (QUALCOMM Incorporated)
- 17456068. INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A PACKAGE SUBSTRATE WITH A DOUBLE SIDE EMBEDDED TRACE SUBSTRATE (ETS), AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17532754. PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 17816502. DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17879594. PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION PORTION COUPLED TO A SECOND METALLIZATION PORTION simplified abstract (QUALCOMM Incorporated)
Q
- Qualcomm incorporated (20240105568). PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS simplified abstract
- Qualcomm incorporated (20240105687). PACKAGE COMPRISING A FLEXIBLE SUBSTRATE simplified abstract
- Qualcomm incorporated (20240105688). PACKAGE COMPRISING AN INTEGRATED DEVICE, A CHIPLET AND A METALLIZATION PORTION simplified abstract