17443740. SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)

SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS

Organization Name

QUALCOMM Incorporated

Inventor(s)

Aniket Patil of San Diego CA (US)

Brigham Navaja of San Diego CA (US)

Hong Bok We of San Diego CA (US)

SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17443740 titled 'SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS

Simplified Explanation

The patent application describes a method for creating split die integrated circuit (IC) packages with a D2D (die-to-die) interconnect structure. This structure allows for communication between multiple dies within the package.

• The split die IC package includes a cavity in the die-substrate standoff area, where the D2D interconnect structure is placed.
• The D2D interconnect structure contains metal interconnects that connect the multiple dies, enabling D2D signal routing.
• The interconnect structure is placed in the cavity formed between the dies and the package substrate, allowing for more space in the package substrate for other interconnections.

Potential Applications

• Split die IC packages can be used in various electronic devices, such as smartphones, tablets, and computers.
• This technology can be beneficial in applications that require high-speed and efficient communication between multiple dies within a package.

Problems Solved

• Traditional IC packages may have limitations in terms of die-to-die communication, which can impact overall performance and efficiency.
• The use of a D2D interconnect structure in a split die IC package solves the problem of limited die-to-die communication by providing a dedicated interconnect system.

Benefits

• The D2D interconnect structure allows for improved communication between multiple dies within a split die IC package.
• By placing the interconnect structure in a cavity, more space is available in the package substrate for other interconnections.
• This technology can enhance the overall performance and efficiency of electronic devices by enabling faster and more efficient die-to-die communication.

Original Abstract Submitted

Split die IC packages employing a D2D interconnect structure in a die-substrate standoff cavity (i.e., cavity) to provide D2D connections, and related fabrication methods. To facilitate D2D communications between multiple dies in the split die IC package, the package substrate also includes a D2D interconnect structure (e.g., interconnect bridge) that contains D2D interconnects (e.g., metal interconnects) coupled to the multiple dies to provide D2D signal routing between the multiple dies. The D2D interconnect structure is disposed in a cavity that is formed in a die standoff area between the dies and the package substrate as a result of the die interconnects being disposed between the dies and the package substrate standing off the dies from the package substrate. The D2D interconnect structure can be provided in the cavity in the IC package outside of the package substrate to reserve more area in the package substrate for other interconnections.