17455576. RECESS STRUCTURE FOR PADLESS STACK VIA simplified abstract (QUALCOMM Incorporated)
Contents
RECESS STRUCTURE FOR PADLESS STACK VIA
Organization Name
Inventor(s)
Hong Bok We of San Diego CA (US)
Joan Rey Villarba Buot of Escondido CA (US)
Aniket Patil of San Diego CA (US)
RECESS STRUCTURE FOR PADLESS STACK VIA - A simplified explanation of the abstract
This abstract first appeared for US patent application 17455576 titled 'RECESS STRUCTURE FOR PADLESS STACK VIA
Simplified Explanation
The patent application describes a stack via structure that consists of multiple vias stacked on top of each other. One of the vias has a recess on its top surface, and another via is formed above it, with its bottom portion fitting into the recess. This eliminates the need for a capture pad between the two vias and enhances the contact area between them.
- Multiple vias are stacked on top of each other in a stack via structure.
- One of the vias has a recess on its top surface.
- Another via is formed above the recessed via, with its bottom portion fitting into the recess.
- This eliminates the need for a capture pad between the two vias.
- The contact area between the vias is enhanced.
Potential Applications
- Integrated circuits
- Semiconductor devices
- Electronics manufacturing
Problems Solved
- Eliminates the need for a capture pad between stacked vias.
- Enhances the contact area between the vias.
Benefits
- Simplifies the structure of stacked vias.
- Improves the efficiency of contact between vias.
- Reduces manufacturing complexity and cost.
Original Abstract Submitted
Disclosed is a stack via structure in which a plurality of vias are stacked over each other. At least one via is a via that has a recess formed from a top surface thereof. Another via above the via is formed such that a bottom portion of the another via is in the recess of the via. In this way, no capture pad is needed between the via and the another via. Also, contact area between the via and the another via is enhanced.
