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Welcome to WikiPatents!
Welcome to WikiPatents
Have you ever tried to understand a patent and found yourself lost?
WikiPatents makes the complicated world of patents simple and interesting.
We make hard-to-understand patents easy to get. Plus, we keep an eye on what big companies are up to every week. But that's not all. WikiPatents is your guide to the exciting world of new inventions and legal moves in technology.
Here, you'll find:
- Simple explanations of patent abstracts, so anyone can understand.
- Weekly updates on what companies are innovating.
- Tips on how to use patents to solve problems or create something new.
- Problems solved, potential commercial applications, and possible prior art for patent applications.
- A friendly place for inventors, tech lovers, and legal folks to learn about patents.
Weekly Reports
Weekly Reports 2024 - Weekly patent application reports in 2024.
Weekly Reports - Weekly reports on patent applications. Covering top technology areas, organizations, and inventors.
All Patent Areas
Patents by Organization - Uncover a wealth of data encompassing patents, patent licensing, and patent transactions, while exploring our dynamic digital repository focused on patent applications and trends within the realm of intellectual property.
Patents by Technology - Patent insights categorized by specific technologies.
Patents by Inventor - Patent insights categorized by inventors.
Organizations that have been involved in Patent Lawsuits - A list of organizations that have been involved, publicly, in patent lawsuits.
Patent strategy - Articles about patent strategy, such as patent troll defense.
University Patents - Patent insights categorized by universities.
Rejected Patents - A catalog of rejected patents.
Patent Brokers - Patent brokers.
Questions about patents - A collection of questions about patents and explanations.
Intellectual Property Resources
Government Patent Offices Around the World
Latest Patent Updates: Stay Informed with WikiPatents
Keep up with the latest in patent changes and updates. Stay ahead of the curve and informed with our updates on the latest patent applications for bleeding-edge technologies.
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- 04:07, 26 April 2024 International business machines corporation (20240138064). MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CIRCUIT BOARD simplified abstract (hist) [4,699 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:07, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128218). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [4,337 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:07, 26 April 2024 International business machines corporation (20240137465). DYNAMICALLY CONTROLLING FOREGROUND APPLICATIONS DURING SCREEN SHARING CONFERENCES simplified abstract (hist) [4,160 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128217). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [3,942 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240137375). FOUNDATIONAL MODEL FOR NETWORK PACKET TRACES simplified abstract (hist) [4,502 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240137303). PROCESSING DATA CONNECTION REQUESTS FROM EDGE DEVICES simplified abstract (hist) [3,910 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128216). CRUCIFORM BONDING STRUCTURE FOR 3D-IC simplified abstract (hist) [4,741 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128211). SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING simplified abstract (hist) [5,133 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240137205). EFFICIENT RANDOM MASKING OF VALUES WHILE MAINTAINING THEIR SIGN UNDER FULLY HOMOMORPHIC ENCRYPTION (FHE) simplified abstract (hist) [3,994 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128196). SEMICONDUCTOR AND METHOD FOR FORMING THE SAME simplified abstract (hist) [3,590 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128194). Integrated Circuit Packages and Methods of Forming the Same simplified abstract (hist) [3,902 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128178). SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (hist) [4,211 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240136414). SOURCE/DRAIN CONTACT AT TIGHT CELL BOUNDARY simplified abstract (hist) [4,613 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128157). Semiconductor Package and Method of Manufacturing the Same simplified abstract (hist) [3,591 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240136289). VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE simplified abstract (hist) [3,973 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128149). COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE simplified abstract (hist) [3,525 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 International business machines corporation (20240136288). Hybrid Power Rail Formation in Dielectric Isolation for Semiconductor Device simplified abstract (hist) [4,815 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:06, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128148). Integrated Circuit Packages and Methods of Forming the Same simplified abstract (hist) [4,695 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:05, 26 April 2024 International business machines corporation (20240136287). Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Downs and Associated Benefits simplified abstract (hist) [3,799 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 04:05, 26 April 2024 Taiwan semiconductor manufacturing co., ltd. (20240128147). SEMICONDUCTOR DEVICE simplified abstract (hist) [2,896 bytes] Wikipatents (talk | contribs) (Creating a new page)
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