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Category:H01L23/498
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Pages in category "H01L23/498"
The following 200 pages are in this category, out of 2,332 total.
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- 17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17458573. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17532754. PACKAGE COMPRISING CHANNEL INTERCONNECTS LOCATED BETWEEN SOLDER INTERCONNECTS simplified abstract (QUALCOMM Incorporated)
- 17568361. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17591144. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17629358. MANUFACTURING METHOD OF METAL GRID, THIN FILM SENSOR AND MANUFACTURING METHOD OF THIN FILM SENSOR simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17651665. Wafer Bonding Incorporating Thermal Conductive Paths simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17654907. Dicing Process in Packages Comprising Organic Interposers simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17655645. Staggered Metal Mesh on Backside of Device Die and Method Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17663683. Semiconductor Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17669914. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17680410. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17682465. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17690270. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17692831. PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17699525. CHIP-ON-FILM PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17700818. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17702440. SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 17712358. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17714490. SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17725163. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17735158. SEMICONDUCTOR PACKAGE ALIGNING INTERPOSER AND SUBSTRATE simplified abstract (Samsung Electronics Co., Ltd.)
- 17740508. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17742862. SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17745666. SEMICONDUCTOR PACKAGE INCLUDING BUMP STRUCTURES WITH DIFFERENT SHAPES simplified abstract (Samsung Electronics Co., Ltd.)
- 17747131. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17754779. POWER SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 17768374. SEMICONDUCTOR DEVICE simplified abstract (Rohm Co., Ltd.)
- 17806985. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17808705. Semiconductor Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17809039. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17814828. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17814836. FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17814997. SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17815629. Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17815784. INDUCTOR PACKAGES EMPLOYING WIRE BONDS OVER A LEAD FRAME TO FORM INTEGRATED INDUCTOR(S), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 17816055. NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17816261. SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17819231. SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17821871. HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING BOARD ASSEMBLIES, RELATED METHODS AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 17821920. Warpage Compensation for BGA Package simplified abstract (Apple Inc.)
- 17822476. SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17823349. MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION simplified abstract (Micron Technology, Inc.)
- 17823634. SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17827063. REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17835776. SEMICONDUCTOR DEVICE AND METHOD OF FORMING REDISTRIBUTION STRUCTURES OF CONDUCTIVE ELEMENTS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17836142. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)
- 17836711. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17837260. SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17840322. SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS simplified abstract (Western Digital Technologies, Inc.)
- 17840744. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17842262. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17844802. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17844815. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17846303. SINGLE LITHOGRAPHY METHODS FOR INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 17846777. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17847257. PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17847282. PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17847652. STRESS-REDUCING DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)
- 17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)
- 17848059. INTEGRATED CIRCUIT PACKAGE WITH PSEUDO-STRIPLINE ARCHITECTURE simplified abstract (Intel Corporation)
- 17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation)
- 17848607. ELECTRICALLY CONDUCTIVE STRIPS ON A SIDE OF A MEMORY MODULE simplified abstract (Intel Corporation)
- 17848615. ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE simplified abstract (Intel Corporation)
- 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)
- 17848630. HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SEMI-ADDITIVE PROCESS BOARD simplified abstract (Intel Corporation)
- 17848643. ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE simplified abstract (Intel Corporation)
- 17849300. SEMICONDUCTOR PACKAGING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17849352. COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES simplified abstract (Intel Corporation)
- 17850187. SEMICONDUCTOR DEVICE WITH MULTIPLE DIES simplified abstract (Texas Instruments Incorporated)
- 17851245. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17851957. INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER simplified abstract (Intel Corporation)
- 17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)
- 17852614. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17858536. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17859411. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17862459. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17862482. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17874404. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17874527. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17876240. SEMICONDUCTOR PACKAGE STRUCTURE HAVING INTERPOSER SUBSTRATE, AND STACKED SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17876558. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17876847. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 17878142. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17878647. Semiconductor Device Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17879106. REDISTRIBUTION SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17879594. PACKAGE COMPRISING AN INTEGRATED DEVICE AND A FIRST METALLIZATION PORTION COUPLED TO A SECOND METALLIZATION PORTION simplified abstract (QUALCOMM Incorporated)
- 17884484. THROUGH-SUBSTRATE CONNECTIONS FOR RECESSED SEMICONDUCTOR DIES simplified abstract (Micron Technology, Inc.)
- 17884695. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 17885022. Compliant Pad Spacer for Three-Dimensional Integrated Circuit Package simplified abstract (GOOGLE LLC)
- 17886461. PACKAGE AND FABRICATION METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17887499. SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17889053. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17893968. SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECTS, AND METHODS FOR MAKING THE SAME simplified abstract (Micron Technology, Inc.)
- 17894063. SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT simplified abstract (Micron Technology, Inc.)
- 17894084. SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17895047. SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17895502. PACKAGE DEVICE WITH AN EMBEDDED OSCILLATION REGION simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)
- 17896083. INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17896097. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17897155. PACKAGE SUBSTRATE FOR A SEMICONDUCTOR DEVICE simplified abstract (Micron Technology, Inc.)
- 17897156. MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS simplified abstract (Micron Technology, Inc.)
- 17897206. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17899477. SUBSTRATES WITH CONTINUOUS SLOT VIAS simplified abstract (Micron Technology, Inc.)
- 17899522. SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SPACERS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS simplified abstract (Micron Technology, Inc.)
- 17899550. WIRE BONDING DIRECTLY ON EXPOSED CONDUCTIVE VIAS AND INTERCONNECTS AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)
- 17899577. SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES, AND METHODS FOR MAKING THE SAME simplified abstract (Micron Technology, Inc.)
- 17900785. SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17901386. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 17914235. DISPLAY PANEL AND DISPLAY DEVICE simplified abstract (Chengdu BOE Optoelectronics Technology Co., Ltd.)
- 17924814. Electronic Device and Chip Packaging Method simplified abstract (Honor Device Co., Ltd.)
- 17927576. WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (BOE Technology Group Co., Ltd.)
- 17929159. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17930942. MEMORY MODULE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17932209. DIE PACKAGE WITH SEALED DIE ENCLOSURES simplified abstract (QUALCOMM Incorporated)
- 17932788. ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract (QUALCOMM Incorporated)
- 17936937. PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17937474. PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract (Intel Corporation)
- 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17937894. ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract (Intel Corporation)
- 17943354. TECHNOLOGIES FOR GLASS CORE INDUCTOR simplified abstract (Intel Corporation)
- 17946109. WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 17955689. LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS simplified abstract (Intel Corporation)
- 17956338. EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 17956384. HYBRID BONDED PASSIVE INTEGRATED DEVICES ON GLASS CORE simplified abstract (Intel Corporation)
- 17956421. DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BONDING simplified abstract (Intel Corporation)
- 17956760. SIDE OF A DIE THAT IS COPLANAR WITH A SIDE OF A MOLDING simplified abstract (Intel Corporation)
- 17957257. EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS simplified abstract (Intel Corporation)
- 17957349. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957355. SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 17957590. INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract (Intel Corporation)
- 17957637. POROUS POLYMER DIELECTRIC LAYER ON CORE simplified abstract (Intel Corporation)
- 17957721. INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH NIOBIUM BARRIER MATERIALS simplified abstract (Intel Corporation)
- 17957751. HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract (Intel Corporation)
- 17957752. PHOTONICALLY STEERED IMPEDANCE SURFACE ANTENNAS simplified abstract (Intel Corporation)
- 17958012. AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES simplified abstract (Intel Corporation)
- 17958053. METHODS AND APPARATUSES FOR THROUGH-GLASS VIAS simplified abstract (Intel Corporation)
- 17968830. ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract (Intel Corporation)
- 17979233. SEMICONDUCTOR PACKAGES HAVING UPPER CONDUCTIVE PATTERNS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17988051. BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17993240. Socket To Support High Performance Multi-die ASICs simplified abstract (Google LLC)
- 18005745. Dielectric Material Layer, Surface Treatment Method, Package Substrate, and Electronic Device simplified abstract (Honor Device Co., Ltd.)
- 18021813. Substrate and Preparation Method thereof, Integrated Passive Device, and Electronic Apparatus simplified abstract (BOE Technology Group Co., Ltd.)
- 18022418. DISPLAY MODULE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE Technology Group Co., Ltd.)
- 18026887. CIRCUIT BOARD, ELECTRONIC APPARATUS AND MANUFACTURING METHOD FOR CIRCUIT BOARD simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18047033. PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract (Intel Corporation)
- 18047670. SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR simplified abstract (NXP B.V.)
- 18049143. DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18050724. INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18051141. CHIP-ON-FILM PACKAGES AND DISPLAY APPARATUSES INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18053806. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18054211. PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract (Intel Corporation)
- 18054225. SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18055605. PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18059089. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18060080. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)
- 18060106. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)
- 18060125. INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract (Intel Corporation)
- 18062125. BALL GRID ARRAY CURRENT METER WITH A CURRENT SENSE WIRE simplified abstract (International Business Machines Corporation)
- 18065250. APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS simplified abstract (Intel Corporation)
- 18065663. LOW RESISTANCE METALIZATION FOR CONNECTING A VERTICAL TRANSPORT FET SINGLE-CPP INVERTER simplified abstract (International Business Machines Corporation)
- 18066448. INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)
- 18067565. THROUGH MOLDING CONTACT ENABLED EMI SHIELDING simplified abstract (QUALCOMM Incorporated)
- 18068123. SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT simplified abstract (International Business Machines Corporation)
- 18069044. PACKAGE BUMPS OF A PACKAGE SUBSTRATE simplified abstract (QUALCOMM Incorporated)
- 18070708. ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCONNECT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18070825. INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18071116. RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract (Intel Corporation)
- 18071164. WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18071257. SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE simplified abstract (Intel Corporation)
- 18071797. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18071901. OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT simplified abstract (Intel Corporation)
- 18071903. PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18071972. MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18074007. SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18085284. PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT simplified abstract (QUALCOMM Incorporated)
- 18085859. FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18086232. GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY simplified abstract (Intel Corporation)
- 18086265. LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18086293. GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract (Intel Corporation)
- 18088360. CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract (Intel Corporation)
- 18089476. THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA simplified abstract (Intel Corporation)
- 18089491. LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 18089499. DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING simplified abstract (Intel Corporation)
- 18089801. GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES simplified abstract (Intel Corporation)
- 18089931. DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIUM NITRIDE LAYER simplified abstract (Intel Corporation)
- 18090205. VIA ADJUSTMENT IN INTEGRATED CIRCUITS BASED ON MACHINE LEARNING simplified abstract (Intel Corporation)
- 18090260. ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE simplified abstract (Intel Corporation)
- 18090305. PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS simplified abstract (Intel Corporation)
- 18090608. MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)
- 18091022. ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES simplified abstract (Intel Corporation)
- 18091150. ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES simplified abstract (Intel Corporation)
- 18091264. STACKED MULTICHIP IC DEVICE PACKAGES INCLUDING A GLASS SUBSTRATE simplified abstract (Intel Corporation)
- 18091349. PACKAGE SUBSTRATE HAVING DEPRESSION simplified abstract (TEXAS INSTRUMENTS INCORPORATED)
- 18091543. APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO REMELT METALLURGY simplified abstract (Intel Corporation)
- 18091548. GLASS SUBSTRATE FABRICATION USING HYBRID BONDING simplified abstract (Intel Corporation)