Category:Adel A. Elsherbini of Chandler AZ (US)
Adel A. Elsherbini
Adel A. Elsherbini from Chandler AZ (US) has applied for patents in technology areas such as H01L25/065, H01L23/498, H01L25/00 with intel corporation.
Patents
Subcategories
This category has the following 3 subcategories, out of 3 total.
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Pages in category "Adel A. Elsherbini of Chandler AZ (US)"
The following 11 pages are in this category, out of 11 total.
1
- 18344260. PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING (Intel Corporation)
- 18345437. PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING (Intel Corporation)
- 18541878. SEMICONDUCTOR PACKAGES WITH ANTENNAS simplified abstract (Intel Corporation)
- 18746188. DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)
- 18942054. MICROELECTRONIC ASSEMBLIES (Intel Corporation)
I
- Intel corporation (20240113052). SEMICONDUCTOR PACKAGES WITH ANTENNAS simplified abstract
- Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240274576). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240339410). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
- Intel corporation (20240355768). MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS simplified abstract
- Intel corporation (20250070083). MICROELECTRONIC ASSEMBLIES