Category:Brandon C. Marin of Gilbert AZ (US)
Brandon C. Marin
Brandon C. Marin from Gilbert AZ (US) has applied for patents in technology areas such as H01L23/482, H01L23/00, H01L23/498 with intel corporation.
Patents
Subcategories
This category has the following 4 subcategories, out of 4 total.
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Pages in category "Brandon C. Marin of Gilbert AZ (US)"
The following 81 pages are in this category, out of 81 total.
1
- 17847407. PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES simplified abstract (Intel Corporation)
- 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)
- 17886278. ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17937894. ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract (Intel Corporation)
- 17938784. PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract (Intel Corporation)
- 17943915. COPPER CLAD LAMINATE (CCL) FOR PLATING PADS WITHIN A GLASS CAVITY FOR GLASS CORE APPLICATIONS simplified abstract (Intel Corporation)
- 17949857. IC PACKAGE WITH LEDS simplified abstract (Intel Corporation)
- 17956338. EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 17956757. PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract (Intel Corporation)
- 17957003. HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract (Intel Corporation)
- 17957225. INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract (Intel Corporation)
- 17957590. INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract (Intel Corporation)
- 17957600. HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17958002. MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract (Intel Corporation)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
- 18047033. PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract (Intel Corporation)
- 18054211. PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract (Intel Corporation)
- 18055605. PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18059057. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18059074. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18059089. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)
- 18060125. INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract (Intel Corporation)
- 18071237. GLASS EMBEDDED TRUE AIR CORE INDUCTORS simplified abstract (Intel Corporation)
- 18071257. SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE simplified abstract (Intel Corporation)
- 18086265. LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18086293. GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract (Intel Corporation)
- 18088360. CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract (Intel Corporation)
- 18089801. GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES simplified abstract (Intel Corporation)
- 18089916. OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract (Intel Corporation)
- 18091014. HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES simplified abstract (Intel Corporation)
- 18091026. ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES simplified abstract (Intel Corporation)
- 18121264. VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18121331. VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract (Intel Corporation)
- 18126134. GLASS CORE SUBSTRATE WITH LGA NOTCH simplified abstract (Intel Corporation)
- 18130582. AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER simplified abstract (Intel Corporation)
- 18130584. EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY simplified abstract (Intel Corporation)
- 18622486. COPPERLESS REGIONS TO CONTROL PLATING GROWTH simplified abstract (Intel Corporation)
I
- Intel corporation (20240101413). SELF-ALIGNED AIR GAP FORMATION IN MICROELECTRONICS PACKAGES simplified abstract
- Intel corporation (20240105571). IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS simplified abstract
- Intel corporation (20240105625). OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS simplified abstract
- Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
- Intel corporation (20240111092). PILLAR STRUCTURES ON AN OPTICAL WAVEGUIDE simplified abstract
- Intel corporation (20240111095). HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER simplified abstract
- Intel corporation (20240112972). MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER simplified abstract
- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113047). INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING EMBEDDED ACTIVE AND PASSIVE COMPONENTS simplified abstract
- Intel corporation (20240113048). INTEGRATED HORIZONTAL VARISTOR ON GLASS CORE FOR VOLTAGE REGULATION simplified abstract
- Intel corporation (20240113158). HIGH SURFACE AREA CAPACITOR IN AN ELECTRONIC SUBSTRATE PACKAGE simplified abstract
- Intel corporation (20240114622). EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract
- Intel corporation (20240114627). ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract
- Intel corporation (20240120305). PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS simplified abstract
- Intel corporation (20240128181). PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract
- Intel corporation (20240162158). PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract
- Intel corporation (20240162191). PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract
- Intel corporation (20240176070). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240176085). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240177918). GLASS EMBEDDED TRUE AIR CORE INDUCTORS simplified abstract
- Intel corporation (20240178157). SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE simplified abstract
- Intel corporation (20240178162). INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract
- Intel corporation (20240178207). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract
- Intel corporation (20240203805). EMBEDDED MEMORY FOR GLASS CORE PACKAGES simplified abstract
- Intel corporation (20240213111). CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract
- Intel corporation (20240213169). LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD simplified abstract
- Intel corporation (20240213170). GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS simplified abstract
- Intel corporation (20240219655). OPTICAL SEMICONDUCTOR PACKAGE AND METHOD simplified abstract
- Intel corporation (20240222130). ENABLING COPPER RECESS FLATTENING THROUGH BLOCKED COPPER ETCHING PROCESSES simplified abstract
- Intel corporation (20240222257). GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES simplified abstract
- Intel corporation (20240222286). HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES simplified abstract
- Intel corporation (20240243088). COPPERLESS REGIONS TO CONTROL PLATING GROWTH simplified abstract
- Intel corporation (20240312853). VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract
- Intel corporation (20240312888). VIA STRUCTURES IN BONDED GLASS SUBSTRATES simplified abstract
- Intel corporation (20240321656). GLASS CORE SUBSTRATE WITH LGA NOTCH simplified abstract
- Intel corporation (20240329339). PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING REPLACEABLE FIBER CONNECTORS simplified abstract
- Intel corporation (20240332195). SPRAY-COATED PHOTORESIST AND PHOTOIMAGEABLE DIELECTRICS TO ENABLE TSV BRIDGE FOR GLASS CORE PACKAGES simplified abstract
- Intel corporation (20240332322). INDUCTORLESS CIRCUITS FOR CURRENT-VOLTAGE CONTROL AND REGULATION IN GLASS CORE simplified abstract
- Intel corporation (20240339381). AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER simplified abstract
- Intel corporation (20240339412). EMBEDDED INTERCONNECT BRIDGE WITH INDUCTOR FOR POWER DELIVERY simplified abstract
- Intel corporation (20250062206). PACKAGE ARCHITECTURE WITH BRIDGE DIES HAVING AIR GAPS AROUND VIAS
- Intel corporation (20250079266). PACKAGE ARCHITECTURE WITH PACKAGE SUBSTRATE HAVING BLIND CAVITY WITH ROUTING ON SIDEWALLS