Category:Chen-Shien Chen of Zhubei City (TW)
Chen-Shien Chen
Chen-Shien Chen from Zhubei City (TW) has applied for patents in technology areas such as H01L25/065, H01L23/00, H01L23/498 with taiwan semiconductor manufacturing co., ltd..
Patents
Pages in category "Chen-Shien Chen of Zhubei City (TW)"
The following 24 pages are in this category, out of 24 total.
1
- 18150256. INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18154540. SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18334695. Integrated Circuit Package and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18403560. SUBSTRATE AND PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18404243. GAP-FILL DIELECTRICS FOR DIE STRUCTURES AND METHODS OF FORMING THE SAME (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18520414. SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18521284. HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18525273. Semiconductor Device with Discrete Blocks simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18526057. SEMICONDUCTOR DEVICE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18662586. PACKAGE STRUCTURE WITH A BARRIER LAYER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18675785. CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18679091. PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
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- Taiwan semiconductor manufacturing co., ltd. (20240096647). HETEROGENEOUS BONDING STRUCTURE AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096827). SEMICONDUCTOR DEVICE AND METHOD simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312900). CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250087633). SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20240105654). METHOD OF MAKING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240112924). INTEGRATED CIRCUIT PACKAGES AND METHODS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240113080). Semiconductor Device with Discrete Blocks simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136317). SUBSTRATE AND PACKAGE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297138). PACKAGE STRUCTURE WITH A BARRIER LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304535). Integrated Circuit Package and Methods of Forming the Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240321661). PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379475). PACKAGE STRUCTURE WITH PROTECTIVE LID simplified abstract