Pages that link to "Category:INTEL CORPORATION"
The following pages link to Category:INTEL CORPORATION:
Displaying 48 items.
- 18478831. SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS (INTEL CORPORATION) (← links)
- 18817279. SEMICONDUCTOR PACKAGE WITH RFIC AND ANTENNA (INTEL CORPORATION) (← links)
- 18477568. OMNI-DIRECTIONAL, MINIATURIZED ANTENNA SYSTEM (INTEL CORPORATION) (← links)
- 18980411. SEMICONDUCTOR PACKAGE CARRIER, AND A CORRESPONDING SYSTEM AND METHOD OF USE (INTEL CORPORATION) (← links)
- 18478727. TECHNIQUES TO ENABLE SMART BATTERY CHARGING (INTEL CORPORATION) (← links)
- 18374696. WIDEBAND CHANNEL SELECTIVE AMPLIFIER STRUCTURES (INTEL CORPORATION) (← links)
- 18374967. TUNABLE MULTI-PHASE RESONANT CLOCK GENERATION AND DISTRIBUTION (INTEL CORPORATION) (← links)
- 18818652. Transmitter and method to generate a transmit signal (INTEL CORPORATION) (← links)
- 18817284. METHODS AND DEVICES TO PERFORM SPECTRUM SENSING (INTEL CORPORATION) (← links)
- 18375348. BIDIRECTIONAL LINK WITH HYBRID SUPPRESSION CIRCUIT (INTEL CORPORATION) (← links)
- 18727194. EIGHT PORT UPLINK TRANSMISSION ENHANCEMENTS (INTEL CORPORATION) (← links)
- 18981500. MULTI-FIBER CABLE CONNECTIVITY (INTEL CORPORATION) (← links)
- 18978334. SECURING AUDIO COMMUNICATIONS (INTEL CORPORATION) (← links)
- 18374179. TECHNIQUES FOR USE OF MIXED WORD SIZE MULTIPLICATION FOR FULLY HOMOMORPHIC ENCRYPTION RELINEARIZATION (INTEL CORPORATION) (← links)
- 18477335. CIRCUITRY AND METHODS FOR EFFICIENT REPLAY PROTECTION OF COMPUTER MEMORY (INTEL CORPORATION) (← links)
- 18979047. METHODS AND APPARATUS TO SECURELY PERFORM CONFIGURATION UPDATES (INTEL CORPORATION) (← links)
- 18375421. ON-DIE KEY GENERATOR FOR FULLY-HOMOMORPHIC ENCRYPTION RELINEARIZATION PUBLIC KEYS (INTEL CORPORATION) (← links)
- 18375317. MULTI-SCHEME HASH-BASED DIGITAL SIGNATURE VERIFICATION PROCESSORS, METHODS, AND SYSTEMS (INTEL CORPORATION) (← links)
- 18977434. MULTI-ENTITY RESOURCE, SECURITY, AND SERVICE MANAGEMENT IN EDGE COMPUTING DEPLOYMENTS (INTEL CORPORATION) (← links)
- 18980933. CONGESTION DETECTION IN INTERCONNECTION NETWORKS (INTEL CORPORATION) (← links)
- 18478967. TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD (INTEL CORPORATION) (← links)
- 18513045. TECHNOLOGIES FOR REDUCING THE IMPACT OF RADIOFREQUENCY INTERFERENCE ON A CIRCUIT BOARD (INTEL CORPORATION) (← links)
- 18374617. THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION (INTEL CORPORATION) (← links)
- 18979203. FOLDABLE THERMAL GROUND PLANES FOR ELECTRONIC DEVICES (INTEL CORPORATION) (← links)
- 18477636. APPARATUS AND METHOD FOR A DEFORMABLE EMI SHIELDING STRUCTURE (INTEL CORPORATION) (← links)
- 18478840. CAPACITIVE VOLTAGE REGULATOR IN INTEGRATED CIRCUIT PACKAGE (INTEL CORPORATION) (← links)
- 18375287. CONTROLLED RECESS OF DUMMY GATE TO TARGET ACTIVE TRANSISTOR PORTION (INTEL CORPORATION) (← links)
- 18375051. TRANSFER OF A 2D MATERIAL TO A TARGET SUBSTRATE (INTEL CORPORATION) (← links)
- 18478626. DIRECT TRANSFER OF TRANSITION METAL DICHALCOGENIDE MONOLAYERS USING DIFFUSION BONDING LAYERS (INTEL CORPORATION) (← links)
- 18375082. INTEGRATED CIRCUIT STRUCTURES HAVING FIN CUTS (INTEL CORPORATION) (← links)
- 18375055. TRANSISTOR COMPRISING A COMPOSITE GATE DIELECTRIC STRUCTURE AND METHOD TO PROVIDE SAME (INTEL CORPORATION) (← links)
- 18375064. INTEGRATED CIRCUIT STRUCTURES WITH INTERNAL SPACERS FOR 2D CHANNEL MATERIALS (INTEL CORPORATION) (← links)
- 18980999. GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING NANOWIRES WITH TIGHT VERTICAL SPACING (INTEL CORPORATION) (← links)
- 18374600. TRENCH CONTACT STRUCTURE WITH ETCH-STOP LAYER (INTEL CORPORATION) (← links)
- 18476624. STACKED TRANSISTORS WITH STRAIN MATERIALS ON SOURCE AND DRAIN (INTEL CORPORATION) (← links)
- 18478545. STACKED NANOWIRE TRANSISTOR STRUCTURES WITH ISOLATION REGIONS BOUND BY GATE CUTS (INTEL CORPORATION) (← links)
- 18375320. EPI HEIGHT REDUCTION FOR IMPROVED TRANSISTOR PERFORMANCE (INTEL CORPORATION) (← links)
- 18375060. METHOD OF FABRICATING A 2D CHANNEL TRANSISTOR BY EMPLOYING SELECTIVE METALLIZATION TO FORM A SOURCE OR DRAIN STRUCTURE (INTEL CORPORATION) (← links)
- 18478691. TRANSITION METAL DICHALCOGENIDE MONOLAYER TRANSFER USING LOW STRAIN TRANSFER PROTECTIVE LAYER (INTEL CORPORATION) (← links)
- 18374528. BACKSIDE SOURCE/DRAIN TRANSISTOR CONTACT FLOW WITH SELECTIVE ETCH MATERIALS FOR ROBUST CONNECTIVITY (INTEL CORPORATION) (← links)
- 18374599. TRENCH CONTACT STRUCTURE WITH AIRGAP SPACER (INTEL CORPORATION) (← links)
- 18374929. NBTI REDUCTION AND RELIABILITY IMPROVEMENT FOR SELECTIVE LAYOUTS (INTEL CORPORATION) (← links)
- 18374607. MULTIPLE VOLTAGE THRESHOLD INTEGRATED CIRCUIT STRUCTURE WITH LOCAL LAYOUT EFFECT TUNING (INTEL CORPORATION) (← links)
- 18375314. MULTI-THRESHOLD SCHEME USING DUAL DIPOLE PATTERNING IN COMPLEMENTARY TRANSISTOR DIELECTRICS (INTEL CORPORATION) (← links)
- 18477414. METHODS FOR DOPING 2D TRANSISTOR DEVICES AND RESULTING ARCHITECTURES (INTEL CORPORATION) (← links)
- 18477947. METAL GATE CUT WITH REDUCED OXIDATION AND PARASITIC CAPACITANCE (INTEL CORPORATION) (← links)
- 18374608. GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CHANNEL STRUCTURES USING SPLIT SOURCE OR DRAIN APPROACHES (INTEL CORPORATION) (← links)
- 18978616. FINS FOR METAL OXIDE SEMICONDUCTOR DEVICE STRUCTURES (INTEL CORPORATION) (← links)