There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:H01L23/04
Subcategories
This category has the following 25 subcategories, out of 25 total.
C
D
J
L
M
N
S
T
U
W
Y
Pages in category "H01L23/04"
The following 61 pages are in this category, out of 61 total.
1
- 17460705. PACKAGE STRUCTURES AND METHOD FOR FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17708852. DUAL SIDE SEAL RINGS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18048972. SEMICONDUCTOR DEVICE WITH CAVITY CARRIER AND METHOD THEREFOR simplified abstract (NXP B.V.)
- 18085284. PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT simplified abstract (QUALCOMM Incorporated)
- 18154540. SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTION CAP simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18357341. SEMICONDUCTOR CHIP HAVING A HIGH THERMAL LIQUID COOLANT simplified abstract (WESTERN DIGITAL TECHNOLOGIES, INC.)
- 18391891. CHIP PACKAGE WITH LID simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18417370. MULTIPLE SEMICONDUCTOR DIE CONTAINER LOAD PORT simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)
- 18469606. TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED TAMPER-DETECT CIRCUITRY (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18516969. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18584007. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18587838. PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHODS OF FORMING THE SAME (Taiwan Semiconductor Manufacturing Company Limited)
- 18627980. SEMICONDUCTOR DEVICE (KABUSHIKI KAISHA TOSHIBA)
- 18627980. SEMICONDUCTOR DEVICE (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
- 18646858. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
- 18671330. SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675679. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18751724. CHIP PACKAGE STRUCTURE WITH LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18764060. SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
- 18766870. SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
- 18817038. INKJET PRINTING DEDICATED TEST PINS (QUALCOMM Incorporated)
- 18820215. SEMICONDUCTOR DEVICE (FUJI ELECTRIC CO., LTD.)
- 18974937. SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18991178. THREE-DIMENSIONAL (3D) PACKAGES AND METHODS FOR 3D PACKAGING (Murata Manufacturing Co., Ltd.)
B
I
K
M
Q
- Qualcomm incorporated (20240203820). PACKAGE COMPRISING A LID STRUCTURE WITH A COMPARTMENT simplified abstract
- Qualcomm incorporated (20240421105). INKJET PRINTING DEDICATED TEST PINS
- QUALCOMM Incorporated patent applications on December 19th, 2024
- QUALCOMM Incorporated patent applications on June 20th, 2024
S
- Samsung electronics co., ltd. (20240312959). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240347508). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20250087651). SEMICONDUCTOR PACKAGE
- Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on October 17th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on October 17th, 2024
- Samsung Electronics Co., Ltd. patent applications on September 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on September 19th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240096719). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240162071). MULTIPLE SEMICONDUCTOR DIE CONTAINER LOAD PORT simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312851). SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250105090). SEMICONDUCTOR DEVICE
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on May 16th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240120294). CHIP PACKAGE WITH LID simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347410). CHIP PACKAGE STRUCTURE WITH LID simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Tesla, inc. (20250006583). SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME
- Tesla, Inc. patent applications on January 2nd, 2025