18991178. THREE-DIMENSIONAL (3D) PACKAGES AND METHODS FOR 3D PACKAGING (Murata Manufacturing Co., Ltd.)
THREE-DIMENSIONAL (3D) PACKAGES AND METHODS FOR 3D PACKAGING
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Stephen John Allen of San Diego CA US
THREE-DIMENSIONAL (3D) PACKAGES AND METHODS FOR 3D PACKAGING
This abstract first appeared for US patent application 18991178 titled 'THREE-DIMENSIONAL (3D) PACKAGES AND METHODS FOR 3D PACKAGING
Original Abstract Submitted
A three-dimensional (3D) package includes one or more frames, circuit assemblies, and an encapsulating material to encapsulate at least a part of the one or more frames and the circuit assemblies. The one or more frames each include one or more supporting portions and conductive connecting portions extending from the one or more supporting portions and defining assembly mounting spaces therebetween. Circuit assemblies are each mounted in one assembly mounting space and electrically attached to corresponding one or more of the first and second conductive connecting portions.