Mitsubishi Electric Corporation patent applications on March 20th, 2025
Patent Applications by Mitsubishi Electric Corporation on March 20th, 2025
Mitsubishi Electric Corporation: 23 patent applications
Mitsubishi Electric Corporation has applied for patents in the areas of H01L23/00 (2), H04B10/079 (2), F24F11/64 (2), B23Q17/24 (1), H04B10/508 (1) B23Q17/2471 (1), H01R13/646 (1), H04W68/02 (1), H04W36/0069 (1), H04L9/32 (1)
With keywords such as: signal, unit, portion, device, object, semiconductor, data, image, terminal, and processing in patent application abstracts.
Patent Applications by Mitsubishi Electric Corporation
Inventor(s): Shigenobu ASADA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): B23Q17/24, B29C64/379, B29C64/393, B33Y30/00, B33Y40/00, B33Y40/20, B33Y50/02
CPC Code(s): B23Q17/2471
Abstract: a measurement device includes: a sensor that acquires image information by imaging an object targeted for addition of materials or cutting; a measurement unit that acquires measurement data by measuring the shape of the object on the basis of the image information, the measurement data representing a shape of the object; a missing region detecting unit that detects a missing region of the object; a measurement data complementing unit that acquires re-measurement data by re-measuring the shape of the object on the basis of the image information which the sensor has acquired by re-imaging, and complements the measurement data with the re-measurement data; and a machining region specifying unit that specifies a machining region for the addition or the cutting, on the basis of the complemented measurement data and a model of a finished product obtained by the addition or the cutting.
Inventor(s): Shinsaku MAEDA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation
IPC Code(s): B60L3/00, G01R31/34
CPC Code(s): B60L3/0061
Abstract: a drive apparatus includes a power circuit and a deterioration determining device. the power circuit outputs, to a load, a current including a current component having a frequency determined by a natural frequency of at least one member of the load or a vibratory member to vibrate when receiving vibration resulting from an electromagnetic excitation force generated in the load or by a value of a natural number multiple of a rotation frequency of a rotator that is one of the at least one member. the deterioration determining device generates frequency domain data based on a sensor signal output by a vibration sensor and determines deterioration of the at least one member of the load or the vibratory member based on a value of a frequency spectrum indicated by the frequency domain data at the natural frequency or the rotation frequency used to determine the frequency of the current component.
Inventor(s): Takayoshi IIDA of Tokyo JP for mitsubishi electric corporation, Noriko TAKAHASHI of Tokyo JP for mitsubishi electric corporation
IPC Code(s): F24F11/50, F24F11/64, F24F120/20
CPC Code(s): F24F11/50
Abstract: a questionnaire sending unit () sends a questionnaire on an allowable temperature range to each of a plurality of users who use an object space. a range information collection unit () collects range information indicating the allowable temperature range by collecting a response to the questionnaire from each of the plurality of users who use the object space. a temperature determination unit () determines a set temperature of the object space on a basis of the range information concerning the plurality of users which is collected by the range information collection unit ().
Inventor(s): Hajime IKEDA of Chiyoda-ku, Tokyo JP for mitsubishi electric corporation
IPC Code(s): F24F11/64
CPC Code(s): F24F11/64
Abstract: a simulator of a learning device simulates a thermal environment of an indoor space predicted to result from air conditioning of the indoor space by an air conditioner in a situation in which at least one of a state of a refrigeration cycle included in the air conditioner and a state of the indoor space is given. a reinforcement learner executes reinforcement learning that employs, as a reward, a value based on the thermal environment simulated by the simulator, and thereby generates a trained model aimed at inferring, from the at least one of the state of the refrigeration cycle and the state of the indoor space, a control value of the air conditioner.
Inventor(s): Keitaro UEDA of Tokyo JP for mitsubishi electric corporation, Yutaka UNEME of Tokyo JP for mitsubishi electric corporation, Rei ARAKI of Tokyo JP for mitsubishi electric corporation, Shuhei ONO of Tokyo JP for mitsubishi electric corporation
IPC Code(s): G01R31/327, G01R19/10, G01R31/52, H02H3/18, H02P27/06
CPC Code(s): G01R31/3278
Abstract: an electronic control device comprises a reverse connection protection relay, a voltage detector, and a control device. the reverse connection protection relay comprises a switching element and a rectifying element. the switching element and the rectifying element are connected in parallel. a negative electrode of the rectifying element and a positive electrode of the rectifying element are connected to a negative electrode of a power source and a load, respectively, the load consuming power supplied from the power source. opening and closing of the switching element are controlled on the basis of a switching control signal indicating presence or absence of power supply from the power source. the voltage detector is configured to detect a potential difference between both ends of the reverse connection protection relay. the control device is configured to determine a state of the reverse connection protection relay on the basis of the potential difference.
Inventor(s): Shoei NASHIMOTO of Tokyo JP for mitsubishi electric corporation
IPC Code(s): G01S7/02, G01S13/66
CPC Code(s): G01S7/023
Abstract: an attack determination unit () determines whether or not an attack using a spoofing signal is present by detecting jitter caused by the attack using the spoofing signal from a beat signal (s). when the jitter has been detected by the attack determination unit (), a post-countermeasure information calculation unit () calculates tracking information (s) after removing information on a distance and a velocity that are observed due to the spoofing signal. an information selection unit () selects tracking information to be used from the tracking information (s) and tracking information (s) generated from the beat signal (s).
Inventor(s): Yusuke SETO of Tokyo JP for mitsubishi electric corporation
IPC Code(s): G06F9/50
CPC Code(s): G06F9/5077
Abstract: a resource management device includes a data acquiring unit to acquire monitoring data indicating a temporal change in a use amount of a resource used in the past by each of containers included in a node among resources of the node, a prediction unit to predict a temporal change in a use amount of the resource to be used in the future by the container from each of pieces of the monitoring data, and calculate a temporal change in a total use amount of the resource to be used in the future by the containers from the prediction result, and a container deleting unit to delete one of the containers when a timing at which the total use amount of the resource becomes larger than the total of the resources of the node is included in the temporal change in the total use amount of the resource.
Inventor(s): Yutaro NISHIDA of Tokyo JP for mitsubishi electric corporation, Satoshi YASUDA of Tokyo JP for mitsubishi electric corporation, Yoshihiro KOSEKI of Tokyo JP for mitsubishi electric corporation, Goichiro HANAOKA of Tokyo JP for mitsubishi electric corporation, Nuttapong ATTRAPADUNG of Tokyo JP for mitsubishi electric corporation, Yusuke SAKAI of Tokyo JP for mitsubishi electric corporation, Jacob Chroeis Nakamura SCHULDT of Tokyo JP for mitsubishi electric corporation
IPC Code(s): G06N3/0464
CPC Code(s): G06N3/0464
Abstract: an inference device () obtains an inference result by executing an inference model by expressing a decimal value that is data on which inference processing is to be performed as an integer value and treating the integer value as a parameter of a convolutional neural network. a proving device () obtains a proof by executing a proof generation algorithm using the inference result as input. a verification device () obtains a verification result by executing a verification algorithm using the proof as input.
Inventor(s): Takashi OGAWA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): G06V10/25, G06T5/50, G06V10/74
CPC Code(s): G06V10/25
Abstract: an equipment operation device includes processing circuitry is configured to; acquire, from a camera, image data indicating a captured image in which operation target equipment and a peripheral region of the operation target equipment appear; perform a process of detecting a difference between the captured image indicated by the acquired image data and a first registered image that has been recorded; record the captured image as a second registered image that is different from the first registered image when the difference is detected, and acquire a second captured image differentiated from the first registered image that has been recorded and to record the second captured image as the second registered image that is different from the first registered image when the difference is not detected; and download an operation application of the operation target equipment appearing in the second registered image having been recorded.
Inventor(s): Masanori MORI of Tokyo JP for mitsubishi electric corporation, Hideaki TAMAZUMI of Aki-gun, Hiroshima JP for mitsubishi electric corporation
IPC Code(s): G06V20/58
CPC Code(s): G06V20/58
Abstract: an object recognition device of the present invention includes: an object detection unit which detects, as an object, a thing present around a sensor platform; a processing target object storage unit which stores the object as a processing target object, with a number there of being an upper limit value or smaller; and an object processing unit which, in a case where the processing target objects whose number is the upper limit value are stored, selects an object having a lowest evaluation value among the stored processing target objects whose number is the upper limit value, determines one object of the selected processing target object and an object newly detected by the object detection unit, and stores the determined object as the processing target object in the processing target object storage unit.
20250096049. SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Tatsuya UDA of Fukuoka JP for mitsubishi electric corporation, Taketo NISHIYAMA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01L23/04, H01L23/00, H01L23/10
CPC Code(s): H01L23/04
Abstract: a semiconductor device includes a case that accommodates a semiconductor chip therein, a sealing material injected into the case, and a lid fitted into an opening of the case. the lid includes a first lid member and a second lid member that partially overlap each other. the first lid member has a first notch portion and a first convex portion in a portion overlapping with the second lid member. the second lid member has a second notch portion and a second convex portion in a portion overlapping with the first lid member. the first lid member and the second lid member are combined each other with the second convex portion being inserted into the first notch portion and the first convex portion being inserted into the second notch portion.
20250096063. SEMICONDUCTOR DEVICE_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Seiu HIGASHIDE of Tokyo JP for mitsubishi electric corporation, Katsumi MIYAWAKI of Tokyo JP for mitsubishi electric corporation, Shunichi ABE of Tokyo JP for mitsubishi electric corporation, Takumi NAGAMINE of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01L23/367, H01L23/00, H01L23/29, H01L23/31
CPC Code(s): H01L23/3672
Abstract: a semiconductor device includes a semiconductor chip, a heat-dissipating plate, and a sealing resin, in which the semiconductor chip is mounted face-down on a substrate, the heat-dissipating plate is bonded to an upper surface of the semiconductor chip with a bonding material, the sealing resin seals the semiconductor chip and side surfaces of the heat-dissipating plate, an upper surface of the heat-dissipating plate is an exposed surface exposed from an upper surface of the sealing resin, a convex portion or a concave portion is provided on the side surface of the heat-dissipating plate, and at least an upper surface of the convex portion or at least a lower surface of the concave portion is in contact with the sealing resin.
Inventor(s): Ayumi SAKAI of Tokyo JP for mitsubishi electric corporation, Yosuke WATANABE of Tokyo JP for mitsubishi electric corporation, Kyota OTSUKA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01R13/646
CPC Code(s): H01R13/646
Abstract: a right angle type connector includes: a first signal terminal for differential signal, including a first portion and a second portion bent via a bent portion, and allocated for one differential signal; a second signal terminal for differential signal, including a first portion and a second portion bent via a bent portion, allocated for an other differential signal, and having a shorter entire length than an entire length of the first signal terminal; a grounding terminal including a first portion and a second portion bent via a bent portion, and allocated for grounding; and a first noise reduction part to increase a parasitic capacitance between the second signal terminal and the grounding terminal, the first noise reduction part being interposed between the first portion located on a bent portion side of the second signal terminal and the first portion located on a bent portion side of the grounding terminal.
Inventor(s): Hayata FUKUSHIMA of Tokyo JP for mitsubishi electric corporation, Seiji NAKANO of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01S5/024, H01S5/0231, H01S5/02345, H01S5/026
CPC Code(s): H01S5/02407
Abstract: a temperature control module () is mounted on the metal stem (). a support block () is provided on the temperature control module. a back surface of a dielectric substrate () is joined to a side surface of the support block. a differential driving signal line () is provided and a semiconductor light modulation device () is mounted on a principal surface of the dielectric substrate. a first lead pin () is connected to one end of the differential driving signal line. the other end of the differential driving signal line is wire-connected to the semiconductor light modulation device. the temperature control module is wire-connected to the second lead pin (). the dielectric substrate has a cutout () on a side of the metal stem. parts of the temperature control module and the support block are positioned in an internal space of the cutout.
Inventor(s): Yuto SHIBUTA of Fukuoka-Shi JP for mitsubishi electric corporation, Shohei HIGASHI of Fukuoka-Shi JP for mitsubishi electric corporation
IPC Code(s): H02M1/08, H03K17/08, H03K17/082, H03K17/18
CPC Code(s): H02M1/08
Abstract: an object is to provide a technique which enables an outer portion to identify a type of an error state from an identification signal in an early state. a semiconductor element drive device includes a plurality of error state detection circuits generating an error signal corresponding to an error state, an error state identification signal generation circuit generating an error state identification signal having a different waveform for each type of the error state and having a pulse width smaller than each error signal based on the plurality of error signals generated in the plurality of error state detection circuits, respectively, and an error state identification signal output terminal outputting an error state identification signal.
Inventor(s): Junya NISHIOKA of Tokyo JP for mitsubishi electric corporation, Takatoshi AKAMATSU of Tokyo JP for mitsubishi electric corporation, Yoshiaki KONISHI of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H04B10/079, H04B10/2575, H04B10/40
CPC Code(s): H04B10/0795
Abstract: an ifof scheme optical transmission system according to the present disclosure includes a transmission-side digital signal processing device including a correction processing unit and a calibration signal generating unit, and a reception-side digital signal processing device including a digital separation processing unit and a weight correction value calculating unit, in which the calibration signal generating unit generates a calibration signal (s(t)), the digital separation processing unit performs demultiplexer processing to separate the calibration signal (s(t)) into a plurality of baseband signals (s(t), s(t), . . . , s(t)), the weight correction value calculating unit calculates parameter coefficients (a, a, . . . , a) on the basis of the baseband signals (s(t), s(t), . . . , s(t)), and the correction processing unit corrects an amplitude of each of a plurality of input radio signal strings that is input using the parameter coefficient (a, a, . . . , a).
Inventor(s): Junya NISHIOKA of Tokyo JP for mitsubishi electric corporation, Yoshiaki KONISHI of Tokyo JP for mitsubishi electric corporation, Seiki NAKAMURA of Tokyo JP for mitsubishi electric corporation, Takatoshi AKAMATSU of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H04B10/54, G02F1/21, H04B10/079, H04B10/508
CPC Code(s): H04B10/541
Abstract: a device includes: a light distributor to split a pulsed beam; a light sensor to convert a first pulsed beam split by the light distributor into an electric signal; an adc to convert the electric signal obtained by the light sensor, which is an analog signal, into a digital signal; a correction superimposition waveform calculation unit to calculate correction superimposition waveform data which is waveform data to correct a distortion due to a temporal intensity fluctuation of a pulsed beam on the basis of superimposition waveform data and the electric signal; a dac to convert the correction superimposition waveform data calculated by the correction superimposition waveform calculation unit, which is a digital signal, into an analog signal; and a light intensity modulator to obtain an intensity-modulated beam by superimposing the correction superimposition waveform data obtained by the dac onto a second pulsed beam split by the light distributor.
Inventor(s): Junya NISHIOKA of Tokyo JP for mitsubishi electric corporation, Yoshiaki KONISHI of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H04J14/02, H04J1/05
CPC Code(s): H04J14/0256
Abstract: an ifof scheme optical transmission system according to the present disclosure technology includes a transmission-side digital signal processor including a system number compressor; and a parameter updater, the system number compressor compressing n digital data streams into m digital data streams, m being smaller than n, and the parameter updater updating a parameter used by the system number compressor by referring to a value of an evaluation function using a signal string handled by the transmission-side digital signal processor as an argument.
Inventor(s): Kenichiro HAYASAKA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H04L9/08, H04L9/30
CPC Code(s): H04L9/0869
Abstract: a parameter generation device generates a seed. a preliminary calculation unit calculates a composite number condition under which a first integer and a second integer obtained by substituting an integer into each of a first polynomial p(x) and a second polynomial r(x) is a composite number. a seed candidate generation unit searches for an integer of which a hamming weight in a signed binary representation is included in a weight range (w). the seed candidate generation unit deletes an integer that satisfies the composite number condition from a set of integers obtained by search, to obtain a set of seed candidates (t). a prime number decision unit extracts, from the set t, integers for which both of a first polynomial and a second polynomial become prime numbers when the integers are substituted into the first polynomial and the second polynomial, and regards the integers as a set (s).
Inventor(s): Masanori IMAGAWA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H04L9/32
CPC Code(s): H04L9/32
Abstract: an embedded device is connectable to an external terminal including an external browser to communicate with the external terminal. a storage stores a web document. a web server transmits the web document stored in the storage to a built-in browser through unencrypted communication and causes the built-in browser to display a first screen that is based on the web document. the web server transmits the web document stored in the storage to the external browser through encrypted communication and causes the external browser to display a second screen that is based on the web document.
20250097790. COMMUNICATION SYSTEM_simplified_abstract_(mitsubishi electric corporation)
Inventor(s): Mitsuru MOCHIZUKI of Tokyo JP for mitsubishi electric corporation, Tadahiro SHIMODA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H04W36/00, H04W36/08, H04W36/18
CPC Code(s): H04W36/0069
Abstract: a communication system includes: a master base station operating as a master node of dual connectivity in which a communication terminal simultaneously connects to two base stations; and a secondary base station operating as a secondary node of the dual connectivity, and in a case where a second connection destination change process is required while executing a first connection destination change process in which a communication terminal changes a master node as a connection destination or a process in which a communication terminal changes a secondary node as a connection destination, the second connection destination change process being a process not falling under the first connection destination change process out of a process in which the master node is changed and a process in which the secondary node is changed, the second connection destination change process is started and the first connection destination change process is canceled.
Inventor(s): Tadahiro SHIMODA of Tokyo JP for mitsubishi electric corporation, Mitsuru MOCHIZUKI of Tokyo JP for mitsubishi electric corporation, Masayuki NAKAZAWA of Tokyo JP for mitsubishi electric corporation, Akinori TAIRA of Tokyo JP for mitsubishi electric corporation, Fumihiro HASEGAWA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H04W68/02, H04W68/12
CPC Code(s): H04W68/02
Abstract: a communication system includes a communication terminal, and a plurality of networks configured to perform radio communication with the communication terminal. a priority of at least one of a paging timing and a paging type is assigned to a paging to be transmitted from each of the plurality of networks. the communication terminal selects a corresponding one of the pagings to be received, based on the priority.
Inventor(s): Shimpei KAMIYA of Tokyo JP for mitsubishi electric corporation, Munenori IKEDA of Tokyo JP for mitsubishi electric corporation, Kenji HARADA of Tokyo JP for mitsubishi electric corporation
IPC Code(s): H01L27/06, H01L29/06, H01L29/66, H01L29/739, H01L29/861
CPC Code(s): H10D84/617
Abstract: a semiconductor device is a semiconductor device in which a transistor is formed on a semiconductor substrate including a first main surface and a second main surface, a transistor region of the semiconductor substrate includes an n-type first semiconductor layer, a p-type second semiconductor layer provided closer to the first main surface than the first semiconductor layer, an n-type third semiconductor layer provided closer to a first main surface side than the second semiconductor layer, a trench gate that penetrates the third semiconductor layer and the second semiconductor layer in a thickness direction from the first main surface and reaches an inside of the first semiconductor layer, and an interlayer insulating film provided on the trench gate. the interlayer insulating film includes at least one narrow width portion in which a length in a width direction intersecting an extending direction of the trench gate in planar view is partially narrowed.
Mitsubishi Electric Corporation patent applications on March 20th, 2025
- Mitsubishi Electric Corporation
- B23Q17/24
- B29C64/379
- B29C64/393
- B33Y30/00
- B33Y40/00
- B33Y40/20
- B33Y50/02
- CPC B23Q17/2471
- Mitsubishi electric corporation
- B60L3/00
- G01R31/34
- CPC B60L3/0061
- F24F11/50
- F24F11/64
- F24F120/20
- CPC F24F11/50
- CPC F24F11/64
- G01R31/327
- G01R19/10
- G01R31/52
- H02H3/18
- H02P27/06
- CPC G01R31/3278
- G01S7/02
- G01S13/66
- CPC G01S7/023
- G06F9/50
- CPC G06F9/5077
- G06N3/0464
- CPC G06N3/0464
- G06V10/25
- G06T5/50
- G06V10/74
- CPC G06V10/25
- G06V20/58
- CPC G06V20/58
- H01L23/04
- H01L23/00
- H01L23/10
- CPC H01L23/04
- H01L23/367
- H01L23/29
- H01L23/31
- CPC H01L23/3672
- H01R13/646
- CPC H01R13/646
- H01S5/024
- H01S5/0231
- H01S5/02345
- H01S5/026
- CPC H01S5/02407
- H02M1/08
- H03K17/08
- H03K17/082
- H03K17/18
- CPC H02M1/08
- H04B10/079
- H04B10/2575
- H04B10/40
- CPC H04B10/0795
- H04B10/54
- G02F1/21
- H04B10/508
- CPC H04B10/541
- H04J14/02
- H04J1/05
- CPC H04J14/0256
- H04L9/08
- H04L9/30
- CPC H04L9/0869
- H04L9/32
- CPC H04L9/32
- H04W36/00
- H04W36/08
- H04W36/18
- CPC H04W36/0069
- H04W68/02
- H04W68/12
- CPC H04W68/02
- H01L27/06
- H01L29/06
- H01L29/66
- H01L29/739
- H01L29/861
- CPC H10D84/617