18646858. SEMICONDUCTOR PACKAGE (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Junghoon Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18646858 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor package includes a package substrate including a first surface and a second surface opposite the first surface, a die disposed on the first surface of the package substrate, a stack structure disposed on the first surface of the package substrate and spaced apart from the die in a horizontal direction, and a socket disposed between the first surface of the package substrate and the stack structure and coupling the package substrate and the stack structure to each other, wherein the stack structure includes a plurality of optical integrated circuit chips stacked vertically with each other.