Tesla, inc. (20250006583). SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME
SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME
Organization Name
Inventor(s)
William Thomas Chi of Fremont CA US
Utkarsh Raheja of Sunnyvale CA US
Sesha Sai Srikant Sarma Gandikota of San Jose CA US
SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME
This abstract first appeared for US patent application 20250006583 titled 'SEMICONDUCTOR PACKAGE WITH PRE-FORMED DIE CLIP AND LEAD FRAME
Original Abstract Submitted
the present disclosure relates to a semiconductor package with a pre-formed die clip and lead frame. the semiconductor package includes a semiconductor die, a heat spreader on a first side of the semiconductor die, a lead frame on a second side of the semiconductor die, and a die clip positioned between the semiconductor die and a portion of the lead frame. the die clip and the lead frame are pre-joined by way of various connection points.
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