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Category:F27B17/00
Subcategories
This category has the following 30 subcategories, out of 30 total.
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Pages in category "F27B17/00"
The following 22 pages are in this category, out of 22 total.
1
- 17889035. WAFER BAKING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18087255. SUBSTRATE SUPPORTS AND TRANSFER APPARATUS FOR SUBSTRATE DEFORMATION simplified abstract (Applied Materials, Inc.)
- 18204459. WAFER HEATING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18560291. GAS CONTROL SYSTEM FOR REFLOW FURNACE AND REFLOW FURNACE simplified abstract (ILLINOIS TOOL WORKS INC.)
- 18574492. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (Tokyo Electron Limited)
- 18666710. HEATER LIFT ASSEMBLY SPRING DAMPER simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18743694. PRE-HEAT RINGS, HEATING SYSTEMS, AND PROCESSING CHAMBERS INCLUDING CARBON HEATERS (Applied Materials, Inc.)
- 18828621. SYSTEMS, METHODS, AND APPARATUS FOR CORRECTING THERMAL PROCESSING OF SUBSTRATES (Applied Materials, Inc.)
- 18928383. CHAMBER BODIES HAVING MACHINED LOWER WALLS, CHAMBER ARRANGEMENTS AND SEMICONDUCTOR PROCESSING SYSTEMS HAVING CHAMBER BODIES WITH MACHINED LOWER WALLS, AND METHODS OF MAKING CHAMBERS WITH MACHINED LOWER WALLS (ASM IP Holding B.V.)
- 18928413. CHAMBER BODIES HAVING MACHINED WALLS, CHAMBER ARRANGEMENTS AND SEMICONDUCTOR PROCESSING SYSTEMS HAVING CHAMBER BODIES WITH MACHINED WALLS, AND METHODS OF MAKING CHAMBER BODIES (ASM IP Holding B.V.)
- 18942312. RTP SUBSTRATE TEMPERATURE ONE FOR ALL CONTROL ALGORITHM (Applied Materials, Inc.)
A
- Applied materials, inc. (20250067511). RTP SUBSTRATE TEMPERATURE ONE FOR ALL CONTROL ALGORITHM
- Applied materials, inc. (20250068195). SYSTEMS, METHODS, AND APPARATUS FOR CORRECTING THERMAL PROCESSING OF SUBSTRATES
- Applied materials, inc. (20250132174). PRE-HEAT RINGS, HEATING SYSTEMS, AND PROCESSING CHAMBERS INCLUDING CARBON HEATERS
- Applied Materials, Inc. patent applications on April 24th, 2025
- Applied Materials, Inc. patent applications on February 27th, 2025
- Applied Materials, Inc. patent applications on January 23rd, 2025
T
- Taiwan semiconductor manufacturing company, ltd. (20240304471). HEATER LIFT ASSEMBLY SPRING DAMPER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250062139). FURNACE INNER TUBE FOR PROCESS UNIFORMITY
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on February 20th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024