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Category:CPC H01L24/11
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Pages in category "CPC H01L24/11"
The following 78 pages are in this category, out of 78 total.
1
- 18147497. METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES simplified abstract (Intel Corporation)
- 18402426. SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS simplified abstract (Micron Technology, Inc.)
- 18420595. Multiple Polymer Layers as the Encapsulant of Conductive Vias (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18454657. ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PADS FOR PROBING A WAFER (Microsoft Technology Licensing, LLC)
- 18601215. SEMICONDUCTOR DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME (SK HYNIX INC.)
- 18674950. SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18825283. ELECTRONIC CHIP WITH CONNECTING PILLARS FOR SINTERING ASSEMBLY (CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE)
- 19000041. SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS (Micron Technology, Inc.)
- 19013241. METAL BUMPS AND METHOD FORMING SAME (Taiwan Semiconductor Manufacturing Company, Ltd.)
A
- AMAZING COOL TECHNOLOGY CORP. Patent Application Trends in 2024
- Ams-OSRAM International GmbH Patent Application Trends in 2025
- Apple Inc Patent Application Trends in 2025
- Apple Inc. Patent Application Trends in 2025
- APPLE INC. Patent Application Trends in 2025
- ATI Technologies ULC Patent Application Trends in 2024
I
- IMEC VZW (20240297136). METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE simplified abstract
- Industrial Technology Research Institute Patent Application Trends in 2024
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE Patent Application Trends in 2024
- Innolux Corporation Patent Application Trends in 2024
- Intel corporation (20240222301). METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES simplified abstract
- Intel Corporation patent applications on July 4th, 2024
- International Business Machines Corporation Patent Application Trends in 2025
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M
- Micron technology, inc. (20250125294). SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS OF MANUFACTURING SACRIFICIAL PILLARS
- Micron Technology, Inc. Patent Application Trends in 2024
- MICRON TECHNOLOGY, INC. Patent Application Trends in 2025
- Micron Technology, Inc. patent applications on April 17th, 2025
- Microsoft technology licensing, llc (20250070067). ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PADS FOR PROBING A WAFER
- Microsoft Technology Licensing, LLC Patent Application Trends in 2024
- Microsoft Technology Licensing, LLC Patent Application Trends in 2025
- MICROSOFT TECHNOLOGY LICENSING, LLC Patent Application Trends in 2025
- Microsoft Technology Licensing, LLC patent applications on February 27th, 2025
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- Samsung Display Co., LTD Patent Application Trends in 2024
- SAMSUNG DISPLAY CO., LTD. Patent Application Trends in 2024
- Samsung Display Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC Patent Application Trends in 2024
- Sk hynix inc. (20250149484). SEMICONDUCTOR DEVICE INCLUDING BUMPS AND METHOD OF MANUFACTURING THE SAME
- SK HYNIX INC. patent applications on May 8th, 2025
- STMicroelectronics (Tours) SAS Patent Application Trends in 2024
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20250140724). Multiple Polymer Layers as the Encapsulant of Conductive Vias
- Taiwan semiconductor manufacturing company, ltd. (20250149485). METAL BUMPS AND METHOD FORMING SAME
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 1st, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 8th, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. Patent Application Trends in 2024
- The Boeing Company Patent Application Trends in 2024