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Category:CPC H01L21/76879
Pages in category "CPC H01L21/76879"
The following 49 pages are in this category, out of 49 total.
1
- 18145157. OCTAGONAL INTERCONNECT WIRING FOR ADVANCED LOGIC simplified abstract (International Business Machines Corporation)
- 18145582. CATALYST-ENHANCED CHEMICAL VAPOR DEPOSITION simplified abstract (Tokyo Electron Limited)
- 18169984. SEMICONDUCTOR STRUCTURES INCLUDING METAL WIRES WITH EDGE CURVATURE simplified abstract (International Business Machines Corporation)
- 18419526. INTEGRATION SOLUTION FOR NAND DEEP CONTACT GAP FILL simplified abstract (Applied Materials, Inc.)
- 18471823. METHOD OF VIA FILLING (Tokyo Electron Limited)
- 18616741. VOID FREE LOW STRESS FILL simplified abstract (Lam Research Corporation)
- 18816416. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF (Samsung Electronics Co., Ltd.)
A
- Adeia Semiconductor Solutions LLC Patent Application Trends in 2024
- Applied materials, inc. (20240282631). INTEGRATION SOLUTION FOR NAND DEEP CONTACT GAP FILL simplified abstract
- Applied materials, inc. (20250006555). FLEXIBLE MONOMER FOR SMOOTH POLYMER SURFACE
- APPLIED MATERIALS, INC. Patent Application Trends in 2025
- Applied Materials, Inc. patent applications on August 22nd, 2024
- Applied Materials, Inc. patent applications on January 2nd, 2025
- Applied Materials, Inc. patent applications on March 6th, 2025
I
- IMEC VZW Patent Application Trends in 2024
- International business machines corporation (20240213092). OCTAGONAL INTERCONNECT WIRING FOR ADVANCED LOGIC simplified abstract
- International business machines corporation (20240282630). SEMICONDUCTOR STRUCTURES INCLUDING METAL WIRES WITH EDGE CURVATURE simplified abstract
- International Business Machines Corporation patent applications on August 22nd, 2024
- International Business Machines Corporation patent applications on June 27th, 2024
L
Q
S
- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20250132202). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on April 24th, 2025
- SK hynix Inc. Patent Application Trends in 2025
T
- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240258166). SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES
- Taiwan semiconductor manufacturing company, ltd. (20240258166). SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2024
- Tokyo Electron Limited Patent Application Trends in 2024
- TOKYO ELECTRON LIMITED Patent Application Trends in 2025
- Tokyo Electron Limited Patent Application Trends in 2025