Samsung electronics co., ltd. (20250132202). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 20250132202 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
a method of manufacturing a semiconductor package with a semiconductor chip including an active surface and an inactive surface opposite to the active surface is presented. the method includes attaching, to the active surface, a film structure including an insulating layer and a first seed layer contacting the insulating layer. a via hole is formed by penetrating the insulating layer and the first seed layer followed by a descumming the insulating layer and the first seed layer in which the via hole is formed. a second seed layer is formed on the insulating layer and on the first seed layer on which the descum process was performed. a photoresist pattern on the second seed layer enables forming a conductive via by filling both a space defined by the via hole with a conductive material and by filling a space defined by the photoresist pattern with the conductive material.