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Category:CPC G02B6/43
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Pages in category "CPC G02B6/43"
The following 60 pages are in this category, out of 60 total.
1
- 18562593. OPTICAL WIRING COMPONENT, OPTICAL DEVICE, AND METHOD OF ASSEMBLING OPTICAL DEVICE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18586919. Photonic Semiconductor Device and Method of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18664224. OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Advanced Semiconductor Engineering, Inc.)
- 18746934. PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING WAVEGUIDE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18795148. INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY (Intel Corporation)
- 18981135. APPARATUS AND METHODS FOR OPTICAL INTERCONNECTS (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18985362. Photonic Semiconductor Device and Method of Manufacture (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19000354. PHOTONICS PACKAGE INTEGRATION (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
2
- 20250164723. Apparatus Method Supporting Optical (Avago Technologies International Sales Pte. Limited)
- 20250172777. C (Taiwan Semiconductor Manufacturing ., .)
- 20250189739. Optical Circ (University of Southern California)
- 20250189740. Imaging Couplers Micr (Unknown Organization)
- 20250216636. Optical Bridge Photonic (Intel)
- 20250231359. Optical Interconnects Using (AvicenaTech, .)
A
- Advanced micro devices Patent Application Trends in 2024
- Ams-OSRAM International GmbH Patent Application Trends in 2025
- Apple Inc Patent Application Trends in 2025
- Apple Inc. Patent Application Trends in 2025
- APPLE INC. Patent Application Trends in 2025
- Apple Patent Application Trends in 2024
- ARRIS Enterprises LLC Patent Application Trends in 2024
- ARRIS ENTERPRISES LLC Patent Application Trends in 2024
C
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G
I
- Intel corporation (20240264396). CO-PACKAGING WITH SILICON PHOTONICS HYBRID PLANAR LIGHTWAVE CIRCUIT simplified abstract
- Intel corporation (20240418951). INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on August 8th, 2024
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on February 6th, 2025
S
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan semiconductor manufacturing co., ltd. (20240192456). Photonic Semiconductor Device and Method of Manufacture simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250110303). APPARATUS AND METHODS FOR OPTICAL INTERCONNECTS
- Taiwan semiconductor manufacturing co., ltd. (20250123458). Photonic Semiconductor Device and Method of Manufacture
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 17th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on April 3rd, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on June 13th, 2024
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240337800). PACKAGE STRUCTURE INCLUDING PHOTONIC PACKAGE AND INTERPOSER HAVING WAVEGUIDE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250130384). PHOTONICS PACKAGE INTEGRATION
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on April 24th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 10th, 2024
- TDK Corporation Patent Application Trends in 2024