OPTICAL INTERCONNECTS USING MICROLEDS

Abstract: microleds may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. in some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. the optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. in some embodiments arrays of microleds and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.

Inventor(s): Bardia Pezeshki, Robert Kalman

CPC Classification: G02B6/43 (Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections)

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