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Category:B24B57/02
Subcategories
This category has the following 16 subcategories, out of 16 total.
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Pages in category "B24B57/02"
The following 51 pages are in this category, out of 51 total.
1
- 17704676. SLURRY SUPPLY DEVICE, SUBSTRATE POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17887718. ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17940403. CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17966021. MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING simplified abstract (Intel Corporation)
- 18185867. MULTI-HEAD DESIGN FOR ULTRASONIC IMPACT GRINDING OF CMCS simplified abstract (Raytheon Technologies Corporation)
- 18229026. RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18230528. CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD OF CONTROLLING THEREOF simplified abstract (Samsung Electronics Co., Ltd.)
- 18274991. POLISHING FLUID RECOVERY AND REUSE SYSTEM FOR SEMICONDUCTOR SUBSTRATE PROCESSING (Applied Materials, Inc.)
- 18377599. RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL (Applied Materials, Inc.)
- 18402891. MULTI-NOZZLE FOR SUPPLYING CMP SLURRY AND CMP EQUIPMENT INCLUDING THE SAME simplified abstract (SK Hynix Inc.)
- 18455192. ABRASIVE SLURRY REGENERATION METHOD AND ABRASIVE SLURRY REGENERATION SYSTEM simplified abstract (Konica Minolta, Inc.)
- 18477159. CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES (Applied Materials, Inc.)
- 18515780. SUBSTRATE POLISHING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18537574. METHOD FOR CMP TEMPERATURE CONTROL simplified abstract (Applied Materials, Inc.)
- 18588320. POLISHING APPARATUS, POLISHING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD simplified abstract (Kioxia Corporation)
- 18597077. CLEANING SYSTEM FOR POLISHING LIQUID DELIVERY ARM simplified abstract (Applied Materials, Inc.)
- 18905005. HIGH SPEED INJECTION NOZZLE FOR PRE-POLISH MODIFICATION OF SUBSTRATE THICKNESS (Applied Materials, Inc.)
- 18910425. BRUSH AGING PAD, CHEMICAL MECHANICAL POLISHING CLEANING APPARATUS, AND BRUSH AGING METHOD (Samsung Electronics Co., Ltd.)
- 18977686. TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING (Applied Materials, Inc.)
A
- Applied materials, inc. (20240253183). APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY simplified abstract
- Applied materials, inc. (20250001547). FACE-UP WAFER ELECTROCHEMICAL PLANARIZATION APPARATUS
- Applied materials, inc. (20250108476). TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
- Applied materials, inc. (20250108477). CHEMICAL MECHANICAL POLISHING EDGE CONTROL WITH PAD RECESSES
- Applied materials, inc. (20250114898). RETAINING RING FOR EDGE COMPENSATION BY SLURRY FLOW CONTROL
- Applied materials, inc. (20250114910). HIGH SPEED INJECTION NOZZLE FOR PRE-POLISH MODIFICATION OF SUBSTRATE THICKNESS
- Applied Materials, Inc. patent applications on April 10th, 2025
- Applied Materials, Inc. patent applications on April 3rd, 2025
- Applied Materials, Inc. patent applications on August 1st, 2024
- Applied Materials, Inc. patent applications on January 2nd, 2025
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- Samsung display co., ltd. (20240292725). MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS USING THE SAME simplified abstract
- Samsung Display Co., LTD. patent applications on August 29th, 2024
- Samsung electronics co., ltd. (20240091902). RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD simplified abstract
- Samsung electronics co., ltd. (20240238936). CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD OF CONTROLLING THEREOF simplified abstract
- Samsung electronics co., ltd. (20240238939). SUBSTRATE POLISHING APPARATUS simplified abstract
- Samsung electronics co., ltd. (20250144768). BRUSH AGING PAD, CHEMICAL MECHANICAL POLISHING CLEANING APPARATUS, AND BRUSH AGING METHOD
- Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 23rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 23rd, 2025
- Samsung Electronics Co., Ltd. patent applications on July 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- Samsung Electronics Co., Ltd. patent applications on May 8th, 2025
U
- US Patent Application 17974280. GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES simplified abstract
- US Patent Application 18359396. Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen simplified abstract
- US Patent Application 18447211. SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION simplified abstract