US Patent Application 17974280. GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES simplified abstract

GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES

Organization Name

Applied Materials, Inc.

Inventor(s)

Chad Pollard of San Jose CA (US)

Shou-Sung Chang of Mountain View CA (US)

Haosheng Wu of San Jose CA (US)

GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17974280 titled 'GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES

Simplified Explanation

- The patent application describes a chemical mechanical polishing assembly that includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit. - The polishing system consists of a platen, a carrier head, and a motor. - The fluid delivery conduit carries a fluid from the fluid source into the polishing system. - The fluid delivery conduit has a conductive wire that allows electrostatic discharge to flow to a ground. - A wire extraction fitting is used to cover and seal the location where the conductive wire passes through the wall of the fluid delivery conduit.

Original Abstract Submitted

A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing system has a platen to support a polishing pad, a carrier head to support a substrate and bring the substrate into contact with the polishing pad, and a motor to cause relative motion between platen and the carrier head. The fluid delivery conduit includes a conductive wire extending through an interior of the conduit to flow electrostatic discharge to a ground, and a wire extraction fitting covering and sealing a location where the conductive wire passes through a wall of the fluid delivery conduit.