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2 May 2025
| N 13:55 | 19004494. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.) diffhist +3,480 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:55 | Category:CHIA-PING Lai of HSINCHU CITY TW diffhist +780 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:55 | Category:JEN-YUAN Chang of HSINCHU CITY TW diffhist +782 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:55 | 19006753. PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.) diffhist +3,496 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:55 | Category:Yi-Hsiu Chen of Hsinchu TW diffhist +731 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | 18618586. ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF (SILICONWARE PRECISION INDUSTRIES CO., LTD.) diffhist +3,721 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | Category:Po-Yuan Su of Taichung City TW diffhist +701 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | Category:Che-Yu Lee of Taichung City TW diffhist +701 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | 18631682. ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF (SILICONWARE PRECISION INDUSTRIES CO., LTD.) diffhist +3,471 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | Category:Chao-Chiang Pu of Taichung City TW diffhist +732 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | Category:Chi-Ching Ho of Taichung City TW diffhist +728 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | Category:Yi-Min Fu of Taichung City TW diffhist +722 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | 18654916. ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF (SILICONWARE PRECISION INDUSTRIES CO., LTD.) diffhist +3,393 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | Category:Lung-Yuan Wang of Taichung City TW diffhist +686 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | Category:Feng Kao of Taichung City TW diffhist +674 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | 18754549. ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF (SILICONWARE PRECISION INDUSTRIES CO., LTD.) diffhist +3,369 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:39 | Category:Sung-Hua Chung of Taichung City TW diffhist +729 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:11 | 18520946. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (NANYA TECHNOLOGY CORPORATION) diffhist +3,762 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:11 | 18385499. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME (NANYA TECHNOLOGY CORPORATION) diffhist +3,762 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:11 | 18536605. SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR FABRICATING THE SAME (NANYA TECHNOLOGY CORPORATION) diffhist +3,531 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:11 | 18385979. SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR FABRICATING THE SAME (NANYA TECHNOLOGY CORPORATION) diffhist +3,527 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:11 | 18520955. SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME (NANYA TECHNOLOGY CORPORATION) diffhist +3,897 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:11 | 18385504. SEMICONDUCTOR DEVICE WITH POLYMER LINER AND METHOD FOR FABRICATING THE SAME (NANYA TECHNOLOGY CORPORATION) diffhist +3,897 Wikipatents talk contribs (Creating a new page) | ||||
| N 13:11 | Category:PING Hsu of NEW TAIPEI CITY TW diffhist +691 Wikipatents talk contribs (Creating a new page) | ||||
| N 12:32 | 18899260. PACKAGE CARRIER HAVING LARGE CORNER LEADS WITH LEAD TIP INSPECTION FEATURE (Infineon Technologies AG) diffhist +3,469 Wikipatents talk contribs (Creating a new page) | ||||
| N 12:32 | Category:Maofen Zhang of München DE diffhist +627 Wikipatents talk contribs (Creating a new page) | ||||
| N 12:32 | Category:Jing Guo of Sauerlach DE diffhist +620 Wikipatents talk contribs (Creating a new page) | ||||
| N 12:15 | 18896935. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF (Innolux Corporation) diffhist +4,296 Wikipatents talk contribs (Creating a new page) | ||||
| N 12:15 | Category:Wen-Hsiang Liao of Miaoli County TW diffhist +617 Wikipatents talk contribs (Creating a new page) | ||||
| N 12:15 | Category:Cheng-Chi Wang of Miaoli County TW diffhist +615 Wikipatents talk contribs (Creating a new page) | ||||
| N 12:15 | 19006108. ELECTRONIC DEVICE (Innolux Corporation) diffhist +3,927 Wikipatents talk contribs (Creating a new page) | ||||
| N 12:15 | Category:Yi-Hung Lin of Miao-Li County TW diffhist +567 Wikipatents talk contribs (Creating a new page) | ||||
| N 12:15 | Category:Cheng-Chi Wang of Miao-Li County TW diffhist +573 Wikipatents talk contribs (Creating a new page) | ||||
| N 11:39 | 18539321. SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF (UNITED MICROELECTRONICS CORP.) diffhist +3,801 Wikipatents talk contribs (Creating a new page) | ||||
| N 11:39 | Category:Tai-Cheng Hou of Tainan City TW diffhist +608 Wikipatents talk contribs (Creating a new page) | ||||
| N 11:04 | 18913256. OPTICAL PACKAGE COMPRISING A COATING BETWEEN AN OPTICAL ELEMENT AND AN ELECTRONIC CHIP (STMicroelectronics International N.V.) diffhist +3,436 Wikipatents talk contribs (Creating a new page) | ||||
| N 11:04 | Category:Julien Cuzzocrea of MONTBONNOT ST MARTIN FR diffhist +723 Wikipatents talk contribs (Creating a new page) | ||||
| N 11:04 | Category:Younes Boutaleb of Grenoble FR diffhist +709 Wikipatents talk contribs (Creating a new page) | ||||
| N 10:47 | 19004085. POSITIONING EQUIPMENT, BONDING EQUIPMENT, POSITIONING METHOD AND BONDING METHOD (Panasonic Intellectual Property Management Co., Ltd.) diffhist +3,644 Wikipatents talk contribs (Creating a new page) | ||||
| N 10:45 | 18498519. DOUBLE-SIDED CONDUCTIVE VIA (Intel Corporation) diffhist +3,913 Wikipatents talk contribs (Creating a new page) | ||||
| N 10:45 | 18494023. PACKAGE ARCHITECTURE WITH THERMAL ENHANCEMENTS FOR VERTICALLY ORIENTED INTEGRATED CIRCUIT DIES (Intel Corporation) diffhist +4,494 Wikipatents talk contribs (Creating a new page) | ||||
| N 10:44 | 18776116. SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation) diffhist +2,637 Wikipatents talk contribs (Creating a new page) | ||||
| N 10:44 | 18667915. SEMICONDUCTOR APPARATUS (Mitsubishi Electric Corporation) diffhist +3,066 Wikipatents talk contribs (Creating a new page) | ||||
| N 10:36 | 18920749. STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE (Micron Technology, Inc.) diffhist +3,728 Wikipatents talk contribs (Creating a new page) | ||||
| N 10:32 | 18921591. POWER MODULE HAVING A FIRST CIRCUIT CARRIER CONTAINING A CARRIER SUBSTRATE (Robert Bosch GmbH) diffhist +3,343 Wikipatents talk contribs (Creating a new page) | ||||
| N 10:32 | 18921556. POWER MODULE WITH A CIRCUIT CARRIER (Robert Bosch GmbH) diffhist +3,516 Wikipatents talk contribs (Creating a new page) | ||||
| N 10:30 | 18498092. INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK (TEXAS INSTRUMENTS INCORPORATED) diffhist +3,982 Wikipatents talk contribs (Creating a new page) | ||||
| N 10:30 | 18498827. DIE WITH CONNECTION PAD (TEXAS INSTRUMENTS INCORPORATED) diffhist +2,601 Wikipatents talk contribs (Creating a new page) | ||||
| N 10:30 | 18498921. LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES (TEXAS INSTRUMENTS INCORPORATED) diffhist +2,836 Wikipatents talk contribs (Creating a new page) | ||||
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