18498827. DIE WITH CONNECTION PAD (TEXAS INSTRUMENTS INCORPORATED)
DIE WITH CONNECTION PAD
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
JOSE ARVIN Plomantes of DAGUPAN PH
JEFFREY Solas of ILOILO CITY PH
DIE WITH CONNECTION PAD
This abstract first appeared for US patent application 18498827 titled 'DIE WITH CONNECTION PAD
Original Abstract Submitted
An IC (integrated circuit) package include an interconnect having a die attach pad and lead. The IC package also includes a die with a first side mounted on the die attach pad and a second side opposing the first side. The second side having a planar region. The planar region having selective polyimide structures between contact points of a connection pad. The IC package also includes a clip coupled to the connection pad and to a lead of the leads.