18498921. LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES (TEXAS INSTRUMENTS INCORPORATED)
LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Amin Ahmad Sijelmassi of Dallas TX US
LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES
This abstract first appeared for US patent application 18498921 titled 'LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES
Original Abstract Submitted
An example apparatus includes: a wire bond tool including a bond wire capillary having a central opening configured for receiving a bond wire in the central opening; a first laser path formed in the capillary configured to focus a first laser beam on the end of the bond wire to form a free air ball; and a second laser path formed in the capillary configured to focus a second laser beam on a bonding location beneath the capillary.
