18776116. SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE (Mitsubishi Electric Corporation)
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 18776116 titled 'SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE
Original Abstract Submitted
A semiconductor manufacturing apparatus includes: a wire guide to supply a wire; a tool to bond the wire supplied by the wire guide to a plurality of bonded portions of each of the semiconductor devices; a first blade to half cut a remaining portion of the wire other than a portion between the plurality of bonded portions; and a second blade having a cutting edge whose angle is an acute angle smaller than an angle of a cutting edge of the first blade and to cut the half cut portion of the wire.