18498092. INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK (TEXAS INSTRUMENTS INCORPORATED)
INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Hidetoshi Inoue of Oyama-shi JP
Sombuddha Chakraborty of Redwood City CA US
Jonathan Montoya of Dallas TX US
Osvaldo Lopez of Annandale NJ US
INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK
This abstract first appeared for US patent application 18498092 titled 'INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEAT SINK
Original Abstract Submitted
A packaged integrated circuit (IC) includes a package substrate and an IC on the package substrate. A first material is on the package substrate and encapsulates the IC. An inductor is coupled to the package substrate. A heat sink includes a second material. The heat sink is coupled to the IC. A third material is on the first material and encapsulates the inductor and at least part of the heat sink. The second material has a higher thermal conductivity than the first and third materials.