Category:Thomas Sounart of Chandler AZ US
Thomas Sounart
Thomas Sounart from Chandler AZ US has applied for patents in technology areas such as H01G4/012, H01L21/48, H01L23/498 with intel corporation.
Patents
Pages in category "Thomas Sounart of Chandler AZ US"
The following 22 pages are in this category, out of 22 total.
1
- 18374515. SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS (INTEL CORPORATION)
- 18374516. SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS (INTEL CORPORATION)
- 18374520. SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES (INTEL CORPORATION)
- 18374522. BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS (INTEL CORPORATION)
- 18374532. CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION)
- 18374559. HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION)
- 18374573. IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES (INTEL CORPORATION)
- 18374574. TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE (INTEL CORPORATION)
- 18374577. PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES (INTEL CORPORATION)
- 18374578. IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT (INTEL CORPORATION)
I
- Intel corporation (20250006781). CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- Intel corporation (20250112127). IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES
- Intel corporation (20250112155). CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY
- Intel corporation (20250112173). PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
- Intel corporation (20250112177). SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS
- Intel corporation (20250112181). BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS
- Intel corporation (20250112185). SUPERHYDROPHOBIC SURFACES FOR LIQUID CONTAINMENT IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS
- Intel corporation (20250112186). TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE
- Intel corporation (20250112187). IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT
- Intel corporation (20250112199). SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
- Intel corporation (20250112200). HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY