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Category:Chun-Yuan Chen of Hsinchu (TW)
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Pages in category "Chun-Yuan Chen of Hsinchu (TW)"
The following 12 pages are in this category, out of 12 total.
1
- 17849734. METHOD FOR FORMING SEMICONDUCTOR DEVICE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18099236. SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18158137. HYBRID CUT METAL GATE TO ACHIEVE MINIMUM CELL PITCHES, REDUCING ROUTING AND RISING THE YIELD simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18172240. DEVICE WITH THROUGH VIA AND RELATED METHODS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18520730. SEMICONDUCTOR DEVICE WITH BACKSIDE GATE ISOLATION STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
T
- Taiwan semiconductor manufacturing co., ltd. (20240096701). DEVICE WITH THROUGH VIA AND RELATED METHODS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240096996). SEMICONDUCTOR DEVICE WITH BACKSIDE GATE ISOLATION STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120391). SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract
U
- US Patent Application 18360332. METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE simplified abstract
- US Patent Application 18360895. Backside Power Rail And Methods Of Forming The Same simplified abstract
- US Patent Application 18366370. STRUCTURE FOR REDUCING SOURCE/DRAIN CONTACT RESISTANCE AT WAFER BACKSIDE simplified abstract
- US Patent Application 18447084. IMPROVED CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE simplified abstract