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Intel corporation (20250112164). CONTROLLING SUBSTRATE BUMP HEIGHT

From WikiPatents

CONTROLLING SUBSTRATE BUMP HEIGHT

Organization Name

intel corporation

Inventor(s)

Bohan Shan of Chandler AZ US

Onur Ozkan of Scottsdale AZ US

Ryan Carrazzone of Chandler AZ US

Rui Zhang of Chandler AZ US

Haobo Chen of Chandler AZ US

Ziyin Lin of Chandler AZ US

Yiqun Bai of Chandler AZ US

Kyle Arrington of Gilbert AZ US

Jose Waimin of Gilbert AZ US

Hongxia Feng of Chandler AZ US

Srinivas Venkata Ramanuja Pietambaram of Chandler AZ US

Gang Duan of Chandler AZ US

Dingying David Xu of Chandler AZ US

Bin Mu of Tempe AZ US

Mohit Gupta of Chandler AZ US

Jeremy D. Ecton of Gilbert AZ US

Brandon C. Marin of Gilbert AZ US

Xiaoying Guo of Chandler AZ US

Steve S. Cho of Chandler AZ US

Ali Lehaf of Phoenix AZ US

Venkata Rajesh Saranam of Phoenix AZ US

Shripad Gokhale of Gilbert AZ US

Kartik Srinivasan of Gilbert AZ US

Edvin Cetegen of Chandler AZ US

Mine Kaya of Scottsdale AZ US

Nicholas S. Haehn of Scottsdale AZ US

Deniz Turan of Chandler AZ US

CONTROLLING SUBSTRATE BUMP HEIGHT

This abstract first appeared for US patent application 20250112164 titled 'CONTROLLING SUBSTRATE BUMP HEIGHT

Original Abstract Submitted

a device comprises a substrate comprising a plurality of build-up layers and a cavity. a bridge die is located within the cavity and a plurality of cavity side bumps are on one side of the bridge die. a plurality of interconnect pads with variable heights are on one of the build-up layers of the substrate coupled to the plurality of the cavity side bumps to bond the bridge die to the substrate.