Category:Tao Li of Slingerlands NY (US)
Tao Li of Slingerlands NY (US)
Executive Summary
Tao Li of Slingerlands NY (US) is an inventor who has filed 20 patents. Their primary areas of innovation include No explanation available (11 patents), No explanation available (10 patents), No explanation available (9 patents), and they have worked with companies such as INTERNATIONAL BUSINESS MACHINES CORPORATION (11 patents), International Business Machines Corporation (9 patents). Their most frequent collaborators include (20 collaborations), (6 collaborations), (5 collaborations).
Patent Filing Activity
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Technology Areas
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List of Technology Areas
- H10D30/6735 (No explanation available): 11 patents
- H10D62/121 (No explanation available): 10 patents
- H10D30/43 (No explanation available): 9 patents
- H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 7 patents
- H10D30/6757 (No explanation available): 7 patents
- H10D30/014 (No explanation available): 6 patents
- H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
- H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
- H10D30/6729 (No explanation available): 5 patents
- H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
- H10D62/151 (No explanation available): 4 patents
- H10D84/038 (No explanation available): 4 patents
- H10D84/85 (No explanation available): 4 patents
- H01L29/41766 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L21/76224 ({using trench refilling with dielectric materials (trench filling with polycristalline silicon): 2 patents
- H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 2 patents
- H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
- H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L27/124 (the substrate being other than a semiconductor body, e.g. an insulating body): 2 patents
- H01L27/1266 (the substrate being other than a semiconductor body, e.g. an insulating body): 2 patents
- H10D64/017 (No explanation available): 2 patents
- H10D84/017 (No explanation available): 2 patents
- H10D64/01 (No explanation available): 2 patents
- H10D84/83 (No explanation available): 2 patents
- H10B10/12 (ELECTRONIC MEMORY DEVICES): 1 patents
- H01L21/823807 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
- H01L21/823871 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
- H01L21/823885 ({with a particular manufacturing method of vertical transistor structures, i.e. with channel vertical to the substrate surface (with a current flow parallel to the substrate surface): 1 patents
- H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/66666 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/7827 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
- H01L21/76831 ({in via holes or trenches, e.g. non-conductive sidewall liners}): 1 patents
- H01L21/76885 ({By forming conductive members before deposition of protective insulating material, e.g. pillars, studs}): 1 patents
- H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L27/0924 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L27/0928 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/823437 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
- H01L21/823418 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
- H01L21/76897 ({Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step (self-aligned silicidation on field effect transistors): 1 patents
- H10D84/013 (No explanation available): 1 patents
- H10D84/0149 (No explanation available): 1 patents
- H10D84/0128 (No explanation available): 1 patents
- H10D30/6748 (No explanation available): 1 patents
- H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
- H01L27/1255 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
- H01L27/127 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
- H10D84/0179 (No explanation available): 1 patents
- H01L21/02532 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/02609 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H10D64/256 (No explanation available): 1 patents
- H01L29/41775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
- H01L29/0669 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H10D64/258 (No explanation available): 1 patents
- H10D84/853 (No explanation available): 1 patents
- H10D30/024 (No explanation available): 1 patents
- H10D30/62 (No explanation available): 1 patents
- H10D62/154 (No explanation available): 1 patents
- H10D62/158 (No explanation available): 1 patents
- H10D84/0151 (No explanation available): 1 patents
- H10D84/0158 (No explanation available): 1 patents
- H10D84/834 (No explanation available): 1 patents
- H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
Companies
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List of Companies
- INTERNATIONAL BUSINESS MACHINES CORPORATION: 11 patents
- International Business Machines Corporation: 9 patents
Collaborators
- Ruilong Xie of Niskayuna NY (US) (20 collaborations)
- Tsung-Sheng Kang of Ballston Lake NY (US) (6 collaborations)
- Nicolas Jean Loubet of GUILDERLAND NY (US) (5 collaborations)
- Julien Frougier of Albany NY (US) (4 collaborations)
- Chanro Park of Clifton Park NY (US) (3 collaborations)
- Juntao Li of Cohoes NY (US) (3 collaborations)
- Kisik Choi of Watervliet NY (US) (3 collaborations)
- Lijuan Zou of Slingerlands NY (US) (3 collaborations)
- Min Gyu Sung of Latham NY (US) (2 collaborations)
- Nicholas Alexander Polomoff of Hopewell Junction NY (US) (2 collaborations)
- Nicholas Anthony Lanzillo of Wynantskill NY (US) (1 collaborations)
- Koichi Motoyama of Clifton Park NY (US) (1 collaborations)
- John Christopher Arnold of North Chatham NY (US) (1 collaborations)
- Huimei Zhou of Albany NY (US) (1 collaborations)
- FENG LIU of Niskayuna NY (US) (1 collaborations)
- Anthony I. Chou of Guilderland NY (US) (1 collaborations)
- Susan Ng Emans of Albany NY (US) (1 collaborations)
- Albert M. Chu of Nashua NH (US) (1 collaborations)
- Nicolas Jean Loubet of Guilderland NY (US) (1 collaborations)
- Sagarika Mukesh of Albany NY (US) (1 collaborations)
- Alexander Reznicek of Troy NY (US) (1 collaborations)
- Joshua M. Rubin of Albany NY (US) (1 collaborations)
- Shay Reboh of Albany NY (US) (1 collaborations)
- Shogo Mochizuki of Mechanicville NY (US) (1 collaborations)
- Shay Reboh of Guilderland NY (US) (1 collaborations)
- Jingyun Zhang of Albany NY (US) (1 collaborations)
Subcategories
This category has the following 5 subcategories, out of 5 total.
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Pages in category "Tao Li of Slingerlands NY (US)"
The following 83 pages are in this category, out of 83 total.
1
- 17457444. TOP VIA WITH PROTECTIVE LINER simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17545574. GATE ALL-AROUND DEVICE WITH THROUGH-STACK NANOSHEET 2D CHANNEL simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17806602. HYBRID SIGNAL AND POWER TRACK FOR STACKED TRANSISTORS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17930739. GAA DEVICE WITH THE SUBSTRATE INCLUDING EMBEDDED INSULATING STRUCTURE BETWEEN BSPDN AND CHANNELS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17932679. BACKSIDE CMOS TRENCH EPI WITH CLOSE N2P SPACE simplified abstract (International Business Machines Corporation)
- 17933861. SELF-ALIGNED BACKSIDE CONTACT WITH DEEP TRENCH LAST FLOW simplified abstract (International Business Machines Corporation)
- 17936825. METHOD AND STRUCTURE OF FORMING BACKSIDE GATE TIE-DOWN simplified abstract (International Business Machines Corporation)
- 17937431. POWER GATING DUMMY POWER TRANSISTORS FOR BACK SIDE POWER DELIVERY NETWORKS simplified abstract (International Business Machines Corporation)
- 17946017. COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) APPARATUS WITH SELF-ALIGNED BACKSIDE CONTACT simplified abstract (International Business Machines Corporation)
- 17946546. STACKED FETS WITH CONTACT PLACEHOLDER STRUCTURES simplified abstract (International Business Machines Corporation)
- 17946740. VIA RESISTANCE TO BACKSIDE POWER RAIL simplified abstract (International Business Machines Corporation)
- 17948664. FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION simplified abstract (International Business Machines Corporation)
- 17955974. Self-Aligned Wafer Backside Gate Signal with Airgap simplified abstract (International Business Machines Corporation)
- 17956918. BACKSIDE CONTACT WITH SHALLOW PLACEHOLDER AND EASY BACKSIDE SEMICONDUCTOR REMOVAL simplified abstract (International Business Machines Corporation)
- 18060056. LATE MIDDLE-OF-LINE GATE CUT WITH POWER BAR FORMATION simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18060544. BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18063987. VERTICAL TRANSPORT FIELD-EFFECT TRANSISTOR WITH LATE FIN CUT simplified abstract (International Business Machines Corporation)
- 18064954. ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT simplified abstract (International Business Machines Corporation)
- 18065965. SELF-ALIGNED BACKSIDE GATE CONTACTS simplified abstract (International Business Machines Corporation)
- 18066620. ENLARGED SHALLOW TRENCH ISOLATION FOR BACKSIDE POWER simplified abstract (International Business Machines Corporation)
- 18069970. EXTENDED SOURCE/DRAIN CONTACT FOR SHIFTED DRAIN VOLTAGE FOR A BACKSIDE POWER DISTRIBUTION NETWORK simplified abstract (International Business Machines Corporation)
- 18077374. GATE CONTROL FOR STAGGERED STACKED FIELD-EFFECT TRANSISTORS simplified abstract (International Business Machines Corporation)
- 18080828. TRANSISTORS WITH DIELECTRIC STACK ISOLATING BACKSIDE POWER RAIL simplified abstract (International Business Machines Corporation)
- 18080892. DIFFUSION BREAK STRUCTURE FOR TRANSISTORS simplified abstract (International Business Machines Corporation)
- 18091997. BACK SIDE CONTACTS FOR SEMICONDUCTOR DEVICES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18145003. FORK SHEET DEVICE WITH WRAPPED SOURCE AND DRAIN CONTACT TO PREVENT NFET TO PFET CONTACT SHORTAGE IN A TIGHT SPACE simplified abstract (International Business Machines Corporation)
- 18145840. DECOUPLING MIM CAPACITOR simplified abstract (International Business Machines Corporation)
- 18146988. FORMATION OF NON-SELF-ALIGNED BACKSIDE CONTACT simplified abstract (International Business Machines Corporation)
- 18147699. INVERTER WITH BACKSIDE POWER DELIVERY NETWORK simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18148392. RELAXED PITCH BACKSIDE MAGNETO-RESISTIVE RANDOM ACCESS MEMORY INTEGRATION WITH SELF-ALIGNED MICRO STUD AND BACKSIDE POWER DISTRIBUTION NETWORK simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18155784. HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN simplified abstract (International Business Machines Corporation)
- 18156024. FORMING WRAP AROUND CONTACT WITH SELF-ALIGNED BACKSIDE CONTACT simplified abstract (International Business Machines Corporation)
- 18177171. BACKSIDE GATE VIA STRUCTURE USING SELF-ALIGNED SCHEME simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18180887. CROSS COUPLED STACKED TRANSISTORS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18210041. PLACEHOLDER WITH DIELECTRIC LINER PROTECTION TO PREVENT DIRECT BACKSIDE CONTACT (DBC) FROM SHORTING TO GATE (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18298402. METAL CONTACT CONNECTION THROUGH DIFFUSION BREAK AREA simplified abstract (International Business Machines Corporation)
- 18334486. BACKSIDE CONTACTS FOR GATE, SOURCE, AND DRAIN (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18336063. SEMICONDUCTOR BACKSIDE ISOLATION FEATURE FOR MERGED EPITAXY (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18344838. SRAM FORMATION FOR VERTICAL FET TRANSISTOR WITH BACKSIDE CONTACT (International Business Machines Corporation)
- 18465247. GATE CONTACT AT GATE ENDS THROUGH BACKSIDE GATE CUT (International Business Machines Corporation)
I
- International business machines corporation (20240096751). SELF-ALIGNED BACKSIDE CONTACT WITH DEEP TRENCH LAST FLOW simplified abstract
- International business machines corporation (20240096752). VIA RESISTANCE TO BACKSIDE POWER RAIL simplified abstract
- International business machines corporation (20240096783). FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION simplified abstract
- International business machines corporation (20240096940). BACKSIDE CMOS TRENCH EPI WITH CLOSE N2P SPACE simplified abstract
- International business machines corporation (20240096951). STACKED FETS WITH CONTACT PLACEHOLDER STRUCTURES simplified abstract
- International business machines corporation (20240096978). COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) APPARATUS WITH SELF-ALIGNED BACKSIDE CONTACT simplified abstract
- International business machines corporation (20240105554). TRANSISTORS WITH VIA-TO-BACKSIDE POWER RAIL SPACERS simplified abstract
- International business machines corporation (20240112984). METHOD AND STRUCTURE OF FORMING BACKSIDE GATE TIE-DOWN simplified abstract
- International business machines corporation (20240113023). Self-Aligned Wafer Backside Gate Signal with Airgap simplified abstract
- International business machines corporation (20240113125). POWER GATING DUMMY POWER TRANSISTORS FOR BACK SIDE POWER DELIVERY NETWORKS simplified abstract
- International business machines corporation (20240113193). BACKSIDE CONTACT WITH SHALLOW PLACEHOLDER AND EASY BACKSIDE SEMICONDUCTOR REMOVAL simplified abstract
- International business machines corporation (20240178142). LATE MIDDLE-OF-LINE GATE CUT WITH POWER BAR FORMATION simplified abstract
- International business machines corporation (20240178143). BURIED OXIDE LAYER AND ETCH STOP LAYER PROCESS FOR DIRECT BACK SIDE CONTACT OF SEMICONDUCTOR DEVICE simplified abstract
- International business machines corporation (20240186219). TRANSISTORS WITH BACKSIDE SOURCE/DRAIN CONTACT AND SPACER simplified abstract
- International business machines corporation (20240186246). POWER GATING TRANSISTOR FOR BSPDN simplified abstract
- International business machines corporation (20240194691). ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT simplified abstract
- International business machines corporation (20240194696). GATE CONTROL FOR STAGGERED STACKED FIELD-EFFECT TRANSISTORS simplified abstract
- International business machines corporation (20240203792). SELF-ALIGNED BACKSIDE GATE CONTACTS simplified abstract
- International business machines corporation (20240203878). ENLARGED SHALLOW TRENCH ISOLATION FOR BACKSIDE POWER simplified abstract
- International business machines corporation (20240204005). TRANSISTORS WITH DIELECTRIC STACK ISOLATING BACKSIDE POWER RAIL simplified abstract
- International business machines corporation (20240204042). DIFFUSION BREAK STRUCTURE FOR TRANSISTORS simplified abstract
- International business machines corporation (20240213141). DECOUPLING MIM CAPACITOR simplified abstract
- International business machines corporation (20240213243). FORK SHEET DEVICE WITH WRAPPED SOURCE AND DRAIN CONTACT TO PREVENT NFET TO PFET CONTACT SHORTAGE IN A TIGHT SPACE simplified abstract
- International business machines corporation (20240213337). EXTENDED SOURCE/DRAIN CONTACT FOR SHIFTED DRAIN VOLTAGE FOR A BACKSIDE POWER DISTRIBUTION NETWORK simplified abstract
- International business machines corporation (20240213338). FORMATION OF NON-SELF-ALIGNED BACKSIDE CONTACT simplified abstract
- International business machines corporation (20240222229). BACK SIDE CONTACTS FOR SEMICONDUCTOR DEVICES simplified abstract
- International business machines corporation (20240222378). INVERTER WITH BACKSIDE POWER DELIVERY NETWORK simplified abstract
- International business machines corporation (20240224812). RELAXED PITCH BACKSIDE MAGNETO-RESISTIVE RANDOM ACCESS MEMORY INTEGRATION WITH SELF-ALIGNED MICRO STUD AND BACKSIDE POWER DISTRIBUTION NETWORK simplified abstract
- International business machines corporation (20240243062). HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN simplified abstract
- International business machines corporation (20240243128). FORMING WRAP AROUND CONTACT WITH SELF-ALIGNED BACKSIDE CONTACT simplified abstract
- International business machines corporation (20240290657). SELF-ALIGNED CONTACT BASED VIA TO BACKSIDE POWER RAIL simplified abstract
- International business machines corporation (20240290688). SUPER VIA WITHIN BACKSIDE LEVEL simplified abstract
- International business machines corporation (20240297098). BACKSIDE GATE VIA STRUCTURE USING SELF-ALIGNED SCHEME simplified abstract
- International business machines corporation (20240304626). CROSS COUPLED STACKED TRANSISTORS simplified abstract
- International business machines corporation (20240332181). STRUCTURE INCLUDING RC-BASED POWER RAIL ESD CLAMPING CIRCUIT simplified abstract
- International business machines corporation (20240339523). VERTICAL TRANSPORT FIELD-EFFECT TRANSISTOR WITH LATE FIN CUT simplified abstract
- International business machines corporation (20240347423). METAL CONTACT CONNECTION THROUGH DIFFUSION BREAK AREA simplified abstract
- International business machines corporation (20240420990). SEMICONDUCTOR BACKSIDE ISOLATION FEATURE FOR MERGED EPITAXY
- International business machines corporation (20240421003). BACKSIDE CONTACTS FOR GATE, SOURCE, AND DRAIN
- International business machines corporation (20240421085). PLACEHOLDER WITH DIELECTRIC LINER PROTECTION TO PREVENT DIRECT BACKSIDE CONTACT (DBC) FROM SHORTING TO GATE
- International business machines corporation (20240429097). SELF-ALIGNED BACKSIDE CONTACT
- International business machines corporation (20240429103). BACKSIDE CONTACT MITIGATING CONTACT TO GATE SHORT
- International business machines corporation (20250089288). GATE CONTACT AT GATE ENDS THROUGH BACKSIDE GATE CUT
Categories:
- Ruilong Xie of Niskayuna NY (US)
- Tsung-Sheng Kang of Ballston Lake NY (US)
- Nicolas Jean Loubet of GUILDERLAND NY (US)
- Julien Frougier of Albany NY (US)
- Chanro Park of Clifton Park NY (US)
- Juntao Li of Cohoes NY (US)
- Kisik Choi of Watervliet NY (US)
- Lijuan Zou of Slingerlands NY (US)
- Min Gyu Sung of Latham NY (US)
- Nicholas Alexander Polomoff of Hopewell Junction NY (US)
- Nicholas Anthony Lanzillo of Wynantskill NY (US)
- Koichi Motoyama of Clifton Park NY (US)
- John Christopher Arnold of North Chatham NY (US)
- Huimei Zhou of Albany NY (US)
- FENG LIU of Niskayuna NY (US)
- Anthony I. Chou of Guilderland NY (US)
- Susan Ng Emans of Albany NY (US)
- Albert M. Chu of Nashua NH (US)
- Nicolas Jean Loubet of Guilderland NY (US)
- Sagarika Mukesh of Albany NY (US)
- Alexander Reznicek of Troy NY (US)
- Joshua M. Rubin of Albany NY (US)
- Shay Reboh of Albany NY (US)
- Shogo Mochizuki of Mechanicville NY (US)
- Shay Reboh of Guilderland NY (US)
- Jingyun Zhang of Albany NY (US)
- Tao Li of Slingerlands NY (US)
- Inventors
- Inventors filing patents with INTERNATIONAL BUSINESS MACHINES CORPORATION
- Inventors filing patents with International Business Machines Corporation