Category:Nicholas Alexander Polomoff of Hopewell Junction NY (US)
Nicholas Alexander Polomoff
Nicholas Alexander Polomoff from Hopewell Junction NY (US) has applied for patents in technology areas such as H01L23/00, H01L21/78, H01L23/544 with international business machines corporation.
Patents
Subcategories
This category has the following 4 subcategories, out of 4 total.
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Pages in category "Nicholas Alexander Polomoff of Hopewell Junction NY (US)"
The following 20 pages are in this category, out of 20 total.
1
- 17931767. INTEGRATED CIRCUIT CHIP WITH BACKSIDE POWER DELIVERY AND MULTIPLE TYPES OF BACKSIDE TO FRONTSIDE VIAS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 17937429. STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS simplified abstract (International Business Machines Corporation)
- 18064954. ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT simplified abstract (International Business Machines Corporation)
- 18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation)
- 18216328. Three Dimensional Crackstop Interweave Architectural Design Using Supervia. (International Business Machines Corporation)
- 18216404. UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS (International Business Machines Corporation)
- 18216887. DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE (International Business Machines Corporation)
- 18216923. DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING (International Business Machines Corporation)
- 18216978. DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR (International Business Machines Corporation)
- 18217008. THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL (International Business Machines Corporation)
- 18342127. PHOTONIC OPTICAL FIBER PACKAGING (International Business Machines Corporation)
- 18367807. Dicing Street Design for Hybrid Bonding (International Business Machines Corporation)
I
- International business machines corporation (20240105612). BACKSIDE POWER DISTRIBUTION NETWORK AND BACKSIDE SINGLE CRYSTAL TRANSISTORS simplified abstract
- International business machines corporation (20240105613). DIRECT BACKSIDE CONTACT WITH REPLACEMENT BACKSIDE DIELECTRIC simplified abstract
- International business machines corporation (20240113055). STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS simplified abstract
- International business machines corporation (20240194691). ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT simplified abstract
- International business machines corporation (20240203816). HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract
- International business machines corporation (20240332239). HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY simplified abstract
- International business machines corporation (20240429178). MONOLITH STRUCTURE FOR BSPDN SEMICONDUCTOR DEVICES
- International business machines corporation (20250087629). Dicing Street Design for Hybrid Bonding