Pages that link to "Category:Omkar G. Karhade of Chandler AZ US"

The following pages link to Category:Omkar G. Karhade of Chandler AZ US:

Displaying 15 items.

• Intel corporation (20250004206). STACKED PACKAGE DESIGN FOR MORE RELIABLE FIBER COUPLING TO PHOTONIC INTEGRATED CIRCUIT (← links)
• Intel corporation (20250006651). SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT (← links)
• Intel corporation (20250006652). FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT (← links)
• Intel corporation (20250006653). FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES (← links)
• Intel corporation (20250006678). PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING (← links)
• Intel corporation (20250006695). PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING (← links)
• Intel corporation (20250096009). LOW COST PACKAGE WARPAGE SOLUTION (← links)
• 18961031. LOW COST PACKAGE WARPAGE SOLUTION (Intel Corporation) (← links)
• Intel corporation (20250112168). HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS (← links)
• Intel corporation (20250112205). DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFACES IN INTEGRATED CIRCUIT COMPONENT PACKAGING (← links)
• 18477813. HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS (INTEL CORPORATION) (← links)
• 18478950. DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFACES IN INTEGRATED CIRCUIT COMPONENT PACKAGING (INTEL CORPORATION) (← links)
• Intel corporation (20250125307). MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS (← links)
• 18985540. MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS (Intel Corporation) (← links)
• 20250167062. Microelectronic Structures I (Intel) (← links)