MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

Abstract: disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. in some embodiments, a microelectronic structure may include a substrate and a bridge.

Inventor(s): Omkar G. Karhade, Xiaoxuan Sun, Nitin A. Deshpande, Sairam Agraharam

CPC Classification: H01L23/3192 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (use of semiconductor devices for measuring ; resistors in general ; magnets, inductors or transformers ; capacitors in general ; electrolytic devices ; batteries or accumulators ; waveguides, resonators or lines of the waveguide type ; line connectors or current collectors ; stimulated-emission devices ; electromechanical resonators ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers ; electric light sources in general ; printed circuits, hybrid circuits, casings or constructional details of electrical apparatus, manufacture of assemblages of electrical components ; use of semiconductor devices in circuits having a particular application, see the subclass for the application))

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