Category:Adel A. Elsherbini of Chandler AZ US
Adel A. Elsherbini
Adel A. Elsherbini from Chandler AZ US has applied for patents in technology areas such as H01L25/065, H01L23/00, H01L23/538 with intel corporation.
Patents
Pages in category "Adel A. Elsherbini of Chandler AZ US"
The following 9 pages are in this category, out of 9 total.
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- Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES
- Intel corporation (20250006678). PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING
- Intel corporation (20250006695). PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING
- Intel corporation (20250096197). SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DEFINED VIAS, AND METHODS OF MAKING SAME
- Intel corporation (20250105136). CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Intel corporation (20250125275). MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS