Pages that link to "Category:Adel A. Elsherbini of Chandler AZ US"
The following pages link to Category:Adel A. Elsherbini of Chandler AZ US:
Displaying 9 items.
- Intel corporation (20250006678). PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING (â links)
- Intel corporation (20250006695). PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING (â links)
- Intel corporation (20250096197). SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DEFINED VIAS, AND METHODS OF MAKING SAME (â links)
- 18968951. SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DEFINED VIAS, AND METHODS OF MAKING SAME (Intel Corporation) (â links)
- Intel corporation (20250105136). CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES (â links)
- 18473887. CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES (Intel Corporation) (â links)
- Intel corporation (20250125275). MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS (â links)
- 18999978. MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS (Intel Corporation) (â links)
- Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES (â links)