18999978. MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS (Intel Corporation)
MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
Organization Name
Inventor(s)
Aleksandar Aleksov of Chandler AZ US
Adel A. Elsherbini of Chandler AZ US
Kristof Darmawikarta of Chandler AZ US
Robert A. May of Chandler AZ US
Sri Ranga Sai Boyapati of Chandler AZ US
MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
This abstract first appeared for US patent application 18999978 titled 'MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
Original Abstract Submitted
An apparatus is provided which comprises: a plurality of first conductive contacts having a first pitch spacing on a substrate surface, a plurality of second conductive contacts having a second pitch spacing on the substrate surface, and a plurality of conductive interconnects disposed within the substrate to couple a first grouping of the plurality of second conductive contacts associated with a first die site with a first grouping of the plurality of second conductive contacts associated with a second die site and to couple a second grouping of the plurality of second conductive contacts associated with the first die site with a second grouping of the plurality of second conductive contacts associated with the second die site, wherein the conductive interconnects to couple the first groupings are present in a layer of the substrate above the conductive interconnects to couple the second groupings. Other embodiments are also disclosed and claimed.