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= Marko Radosavljevic = | == Marko Radosavljevic of Portland OR (US) == | ||
Marko Radosavljevic | === Executive Summary === | ||
Marko Radosavljevic of Portland OR (US) is an inventor who has filed 7 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as Intel Corporation (6 patents), INTEL CORPORATION (1 patents). Their most frequent collaborators include [[Category:Rachel A. Steinhardt of Beaverton OR (US)|Rachel A. Steinhardt of Beaverton OR (US)]] (5 collaborations), [[Category:Kevin P. O'Brien of Portland OR (US)|Kevin P. O'Brien of Portland OR (US)]] (5 collaborations), [[Category:Punyashloka Debashis of Hillsboro OR (US)|Punyashloka Debashis of Hillsboro OR (US)]] (5 collaborations). | |||
== | === Patent Filing Activity === | ||
[[File:Marko_Radosavljevic_of_Portland_OR_(US)_Monthly_Patent_Applications.png|border|800px]] | |||
=== Technology Areas === | |||
[[File:Marko_Radosavljevic_of_Portland_OR_(US)_Top_Technology_Areas.png|border|800px]] | |||
==== List of Technology Areas ==== | |||
* [[:Category:CPC_H01L29/78391|H01L29/78391]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents | |||
* [[:Category:CPC_H01L29/0673|H01L29/0673]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | |||
* [[:Category:CPC_H01L29/42392|H01L29/42392]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | |||
* [[:Category:CPC_H01L29/775|H01L29/775]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents | |||
* [[:Category:CPC_H01L29/0847|H01L29/0847]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | |||
* [[:Category:CPC_H01L29/78696|H01L29/78696]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | |||
* [[:Category:CPC_H01L29/516|H01L29/516]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | |||
* [[:Category:CPC_H01L29/66969|H01L29/66969]] ({of devices having semiconductor bodies not comprising group 14 or group 13/15 materialsΒ (comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide): 2 patents | |||
* [[:Category:CPC_H01L29/7869|H01L29/7869]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents | |||
* [[:Category:CPC_H01L21/823475|H01L21/823475]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents | |||
* [[:Category:CPC_H01L27/088|H01L27/088]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |||
* [[:Category:CPC_H01L29/0665|H01L29/0665]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |||
* [[:Category:CPC_H01L27/0922|H01L27/0922]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |||
* [[:Category:CPC_H01L21/8221|H01L21/8221]] ({Three dimensional integrated circuits stacked in different levels}): 1 patents | |||
* [[:Category:CPC_H01L21/823807|H01L21/823807]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents | |||
* [[:Category:CPC_H01L21/823814|H01L21/823814]] (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents | |||
* [[:Category:CPC_H01L29/66439|H01L29/66439]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |||
* [[:Category:CPC_H01L29/12|H01L29/12]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |||
* [[:Category:CPC_H01L29/785|H01L29/785]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |||
* [[:Category:CPC_H01L29/24|H01L29/24]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |||
* [[:Category:CPC_H01L29/4966|H01L29/4966]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |||
* [[:Category:CPC_H01L29/7831|H01L29/7831]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |||
* [[:Category:CPC_H01L29/7606|H01L29/7606]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |||
* [[:Category:CPC_H01L29/40111|H01L29/40111]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents | |||
* [[:Category:CPC_H10N70/8836|H10N70/8836]] (No explanation available): 1 patents | |||
* [[:Category:CPC_H10B63/20|H10B63/20]] (ELECTRONIC MEMORY DEVICES): 1 patents | |||
* [[:Category:CPC_H10B63/80|H10B63/80]] (ELECTRONIC MEMORY DEVICES): 1 patents | |||
* [[:Category:CPC_H10B99/16|H10B99/16]] (ELECTRONIC MEMORY DEVICES): 1 patents | |||
* [[:Category:CPC_H10B99/22|H10B99/22]] (ELECTRONIC MEMORY DEVICES): 1 patents | |||
* [[:Category:CPC_H10N70/021|H10N70/021]] (No explanation available): 1 patents | |||
* [[:Category:CPC_H10N70/841|H10N70/841]] (No explanation available): 1 patents | |||
=== Companies === | |||
[[File:Marko_Radosavljevic_of_Portland_OR_(US)_Top_Companies.png|border|800px]] | |||
==== List of Companies ==== | |||
* Intel Corporation: 6 patents | |||
* INTEL CORPORATION: 1 patents | |||
=== Collaborators === | |||
* [[:Category:Rachel A. Steinhardt of Beaverton OR (US)|Rachel A. Steinhardt of Beaverton OR (US)]][[Category:Rachel A. Steinhardt of Beaverton OR (US)]] (5 collaborations) | |||
* [[:Category:Kevin P. O'Brien of Portland OR (US)|Kevin P. O'Brien of Portland OR (US)]][[Category:Kevin P. O'Brien of Portland OR (US)]] (5 collaborations) | |||
* [[:Category:Punyashloka Debashis of Hillsboro OR (US)|Punyashloka Debashis of Hillsboro OR (US)]][[Category:Punyashloka Debashis of Hillsboro OR (US)]] (5 collaborations) | |||
* [[:Category:Arnab Sen Gupta of Hillsboro OR (US)|Arnab Sen Gupta of Hillsboro OR (US)]][[Category:Arnab Sen Gupta of Hillsboro OR (US)]] (5 collaborations) | |||
* [[:Category:Brandon Holybee of Portland OR (US)|Brandon Holybee of Portland OR (US)]][[Category:Brandon Holybee of Portland OR (US)]] (5 collaborations) | |||
* [[:Category:Raseong Kim of Portland OR (US)|Raseong Kim of Portland OR (US)]][[Category:Raseong Kim of Portland OR (US)]] (5 collaborations) | |||
* [[:Category:Matthew V. Metz of Portland OR (US)|Matthew V. Metz of Portland OR (US)]][[Category:Matthew V. Metz of Portland OR (US)]] (5 collaborations) | |||
* [[:Category:John J. Plombon of Portland OR (US)|John J. Plombon of Portland OR (US)]][[Category:John J. Plombon of Portland OR (US)]] (5 collaborations) | |||
* [[:Category:I-Cheng Tung of Hillsboro OR (US)|I-Cheng Tung of Hillsboro OR (US)]][[Category:I-Cheng Tung of Hillsboro OR (US)]] (5 collaborations) | |||
* [[:Category:Ian Alexander Young of Olympia WA (US)|Ian Alexander Young of Olympia WA (US)]][[Category:Ian Alexander Young of Olympia WA (US)]] (5 collaborations) | |||
* [[:Category:Dmitri Evgenievich Nikonov of Beaverton OR (US)|Dmitri Evgenievich Nikonov of Beaverton OR (US)]][[Category:Dmitri Evgenievich Nikonov of Beaverton OR (US)]] (5 collaborations) | |||
* [[:Category:Dominique A. Adams of Portland OR (US)|Dominique A. Adams of Portland OR (US)]][[Category:Dominique A. Adams of Portland OR (US)]] (4 collaborations) | |||
* [[:Category:Gauri Auluck of Hillsboro OR (US)|Gauri Auluck of Hillsboro OR (US)]][[Category:Gauri Auluck of Hillsboro OR (US)]] (4 collaborations) | |||
* [[:Category:Pratyush P. Buragohain of Hillsboro OR (US)|Pratyush P. Buragohain of Hillsboro OR (US)]][[Category:Pratyush P. Buragohain of Hillsboro OR (US)]] (4 collaborations) | |||
* [[:Category:Scott B. Clendenning of Portland OR (US)|Scott B. Clendenning of Portland OR (US)]][[Category:Scott B. Clendenning of Portland OR (US)]] (4 collaborations) | |||
* [[:Category:Carly Rogan of North Plains OR (US)|Carly Rogan of North Plains OR (US)]][[Category:Carly Rogan of North Plains OR (US)]] (4 collaborations) | |||
* [[:Category:Tristan A. Tronic of Aloha OR (US)|Tristan A. Tronic of Aloha OR (US)]][[Category:Tristan A. Tronic of Aloha OR (US)]] (4 collaborations) | |||
* [[:Category:Leonard P. Guler of Hillsboro OR (US)|Leonard P. Guler of Hillsboro OR (US)]][[Category:Leonard P. Guler of Hillsboro OR (US)]] (2 collaborations) | |||
* [[:Category:Hai Li of Portland OR (US)|Hai Li of Portland OR (US)]][[Category:Hai Li of Portland OR (US)]] (2 collaborations) | |||
* [[:Category:Desalegne B. Teweldebrhan of Sherwood OR (US)|Desalegne B. Teweldebrhan of Sherwood OR (US)]][[Category:Desalegne B. Teweldebrhan of Sherwood OR (US)]] (1 collaborations) | |||
* [[:Category:Shengsi Liu of Portland OR (US)|Shengsi Liu of Portland OR (US)]][[Category:Shengsi Liu of Portland OR (US)]] (1 collaborations) | |||
* [[:Category:Saurabh Acharya of Hillsboro OR (US)|Saurabh Acharya of Hillsboro OR (US)]][[Category:Saurabh Acharya of Hillsboro OR (US)]] (1 collaborations) | |||
* [[:Category:Richard Schenker of Portland OR (US)|Richard Schenker of Portland OR (US)]][[Category:Richard Schenker of Portland OR (US)]] (1 collaborations) | |||
* [[:Category:Aryan Navabi-Shirazi of Portland OR (US)|Aryan Navabi-Shirazi of Portland OR (US)]][[Category:Aryan Navabi-Shirazi of Portland OR (US)]] (1 collaborations) | |||
* [[:Category:Michael Babb of Portland OR (US)|Michael Babb of Portland OR (US)]][[Category:Michael Babb of Portland OR (US)]] (1 collaborations) | |||
* [[:Category:Kai Loon Cheong of Hillsboro OR (US)|Kai Loon Cheong of Hillsboro OR (US)]][[Category:Kai Loon Cheong of Hillsboro OR (US)]] (1 collaborations) | |||
* [[:Category:Cheng-Ying Huang of Hillsboro OR (US)|Cheng-Ying Huang of Hillsboro OR (US)]][[Category:Cheng-Ying Huang of Hillsboro OR (US)]] (1 collaborations) | |||
* [[:Category:Mohammad Hasan of Portland OR (US)|Mohammad Hasan of Portland OR (US)]][[Category:Mohammad Hasan of Portland OR (US)]] (1 collaborations) | |||
* [[:Category:Uygar E. Avci of Portland OR (US)|Uygar E. Avci of Portland OR (US)]][[Category:Uygar E. Avci of Portland OR (US)]] (1 collaborations) | |||
* [[:Category:Sudarat Lee of Hillsboro OR (US)|Sudarat Lee of Hillsboro OR (US)]][[Category:Sudarat Lee of Hillsboro OR (US)]] (1 collaborations) | |||
* [[:Category:Hojoon Ryu of Hillsboro OR (US)|Hojoon Ryu of Hillsboro OR (US)]][[Category:Hojoon Ryu of Hillsboro OR (US)]] (1 collaborations) | |||
[[Category:Marko Radosavljevic of Portland OR (US)]] | |||
[[Category:Inventors]] | [[Category:Inventors]] | ||
[[Category: | [[Category:Inventors filing patents with Intel Corporation]] | ||
[[Category: | [[Category:Inventors filing patents with INTEL CORPORATION]] | ||
Latest revision as of 03:48, 28 March 2025
Marko Radosavljevic of Portland OR (US)
Executive Summary
Marko Radosavljevic of Portland OR (US) is an inventor who has filed 7 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as Intel Corporation (6 patents), INTEL CORPORATION (1 patents). Their most frequent collaborators include (5 collaborations), (5 collaborations), (5 collaborations).
Patent Filing Activity
Technology Areas
List of Technology Areas
- H01L29/78391 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
- H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
- H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L29/516 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L29/66969 ({of devices having semiconductor bodies not comprising group 14 or group 13/15 materials (comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide): 2 patents
- H01L29/7869 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
- H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
- H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L27/0922 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/8221 ({Three dimensional integrated circuits stacked in different levels}): 1 patents
- H01L21/823807 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
- H01L21/823814 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
- H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/12 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/785 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/4966 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/7831 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/7606 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L29/40111 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H10N70/8836 (No explanation available): 1 patents
- H10B63/20 (ELECTRONIC MEMORY DEVICES): 1 patents
- H10B63/80 (ELECTRONIC MEMORY DEVICES): 1 patents
- H10B99/16 (ELECTRONIC MEMORY DEVICES): 1 patents
- H10B99/22 (ELECTRONIC MEMORY DEVICES): 1 patents
- H10N70/021 (No explanation available): 1 patents
- H10N70/841 (No explanation available): 1 patents
Companies
List of Companies
- Intel Corporation: 6 patents
- INTEL CORPORATION: 1 patents
Collaborators
- Rachel A. Steinhardt of Beaverton OR (US) (5 collaborations)
- Kevin P. O'Brien of Portland OR (US) (5 collaborations)
- Punyashloka Debashis of Hillsboro OR (US) (5 collaborations)
- Arnab Sen Gupta of Hillsboro OR (US) (5 collaborations)
- Brandon Holybee of Portland OR (US) (5 collaborations)
- Raseong Kim of Portland OR (US) (5 collaborations)
- Matthew V. Metz of Portland OR (US) (5 collaborations)
- John J. Plombon of Portland OR (US) (5 collaborations)
- I-Cheng Tung of Hillsboro OR (US) (5 collaborations)
- Ian Alexander Young of Olympia WA (US) (5 collaborations)
- Dmitri Evgenievich Nikonov of Beaverton OR (US) (5 collaborations)
- Dominique A. Adams of Portland OR (US) (4 collaborations)
- Gauri Auluck of Hillsboro OR (US) (4 collaborations)
- Pratyush P. Buragohain of Hillsboro OR (US) (4 collaborations)
- Scott B. Clendenning of Portland OR (US) (4 collaborations)
- Carly Rogan of North Plains OR (US) (4 collaborations)
- Tristan A. Tronic of Aloha OR (US) (4 collaborations)
- Leonard P. Guler of Hillsboro OR (US) (2 collaborations)
- Hai Li of Portland OR (US) (2 collaborations)
- Desalegne B. Teweldebrhan of Sherwood OR (US) (1 collaborations)
- Shengsi Liu of Portland OR (US) (1 collaborations)
- Saurabh Acharya of Hillsboro OR (US) (1 collaborations)
- Richard Schenker of Portland OR (US) (1 collaborations)
- Aryan Navabi-Shirazi of Portland OR (US) (1 collaborations)
- Michael Babb of Portland OR (US) (1 collaborations)
- Kai Loon Cheong of Hillsboro OR (US) (1 collaborations)
- Cheng-Ying Huang of Hillsboro OR (US) (1 collaborations)
- Mohammad Hasan of Portland OR (US) (1 collaborations)
- Uygar E. Avci of Portland OR (US) (1 collaborations)
- Sudarat Lee of Hillsboro OR (US) (1 collaborations)
- Hojoon Ryu of Hillsboro OR (US) (1 collaborations)
Subcategories
This category has only the following subcategory.
M
Pages in category "Marko Radosavljevic of Portland OR (US)"
The following 48 pages are in this category, out of 48 total.
1
- 17809329. DIFFUSION CUT STRESSORS FOR STACKED TRANSISTORS simplified abstract (Intel Corporation)
- 17838637. DUAL METAL SILICIDE FOR STACKED TRANSISTOR DEVICES simplified abstract (Intel Corporation)
- 17838646. SOURCE AND DRAIN CONTACTS FORMED USING SACRIFICIAL REGIONS OF SOURCE AND DRAIN simplified abstract (Intel Corporation)
- 17847555. MOBILITY IMPROVEMENT IN GATE ALL AROUND TRANSISTORS BASED ON SUBSTRATE ORIENTATION simplified abstract (Intel Corporation)
- 17847628. LOWER DEVICE ACCESS IN STACKED TRANSISTOR DEVICES simplified abstract (Intel Corporation)
- 17851658. SELF-ALIGNED EMBEDDED SOURCE AND DRAIN CONTACTS simplified abstract (Intel Corporation)
- 17947071. FERRORELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICES WITH LOW OPERATING VOLTAGE CAPABILITIES simplified abstract (Intel Corporation)
- 17956296. TECHNOLOGIES FOR PEROVSKITE TRANSISTORS simplified abstract (Intel Corporation)
- 17958094. TECHNOLOGIES FOR TRANSISTORS WITH A THIN-FILM FERROELECTRIC simplified abstract (Intel Corporation)
- 18064362. MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW simplified abstract (Intel Corporation)
- 18088541. INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE HIGH simplified abstract (Intel Corporation)
- 18088542. GALLIUM NITRIDE (GAN) LAYER ON SUBSTRATE CARBURIZATION FOR INTEGRATED CIRCUIT TECHNOLOGY simplified abstract (Intel Corporation)
- 18088545. GALLIUM NITRIDE (GAN) DEVICES WITH THROUGH-SILICON VIAS simplified abstract (Intel Corporation)
- 18089919. TRANSISTOR WITH A BODY AND BACK GATE STRUCTURE IN DIFFERENT MATERIAL LAYERS simplified abstract (Intel Corporation)
- 18091676. TECHNOLOGIES FOR RIBBON FIELD EFFECT TRANSISTORS WITH VARIABLE FIN NUMBERS simplified abstract (Intel Corporation)
- 18091714. TECHNOLOGIES FOR RIBBON FIELD EFFECT TRANSISTORS WITH VARIABLE FIN CHANNEL DIMENSIONS simplified abstract (Intel Corporation)
- 18216520. STACKED CMOS TRANSISTOR STRUCTURES WITH COMPLEMENTARY CHANNEL MATERIALS (Intel Corporation)
- 18244090. GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIAL NANOWIRE THICKNESS AND GATE OXIDE THICKNESS (Intel Corporation)
- 18343203. P-TYPE PEROVSKITE FERROELECTRIC FIELD EFFECT TRANSISTOR (FEFET) DEVICES (Intel Corporation)
- 18344022. NEGATIVE CAPACITANCE FIELD EFFECT TRANSISTOR (NCFET) DEVICES (Intel Corporation)
- 18345127. TECHNOLOGIES FOR BARRIER LAYERS IN PEROVSKITE TRANSISTORS (Intel Corporation)
- 18345168. STACKED TRANSISTOR STRUCTURES WITH DIFFERENT RIBBON MATERIALS (Intel Corporation)
- 18346212. TWO-TERMINAL FERROELECTRIC PEROVSKITE DIODE MEMORY ELEMENT (Intel Corporation)
- 18346227. PEROVSKITE OXIDE FIELD EFFECT TRANSISTOR WITH HIGHLY DOPED SOURCE AND DRAIN (Intel Corporation)
- 18455446. RECESSED VIA WITH CONDUCTIVE LINK TO ADJACENT CONTACT (Intel Corporation)
- 18513028. GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CHANNEL STRUCTURES USING SELECTIVE BOTTOM-UP APPROACH simplified abstract (Intel Corporation)
- 18614290. STACKED FORKSHEET TRANSISTORS simplified abstract (Intel Corporation)
I
- Intel corporation (20240105810). VERTICAL FERRORELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICES simplified abstract
- Intel corporation (20240105822). STACKED PEROVSKITE FERROELECTRIC FIELD EFFECT TRANSISTOR (FEFET) DEVICES simplified abstract
- Intel corporation (20240113212). TECHNOLOGIES FOR PEROVSKITE TRANSISTORS simplified abstract
- Intel corporation (20240113220). TECHNOLOGIES FOR TRANSISTORS WITH A THIN-FILM FERROELECTRIC simplified abstract
- Intel corporation (20240128269). VOLTAGE REGULATOR CIRCUIT INCLUDING ONE OR MORE THIN-FILM TRANSISTORS simplified abstract
- Intel corporation (20240194672). MULTI-PITCH PATTERNING THROUGH ONE-STEP FLOW simplified abstract
- Intel corporation (20240204059). GALLIUM NITRIDE (GAN) WITH INTERLAYERS FOR INTEGRATED CIRCUIT TECHNOLOGY simplified abstract
- Intel corporation (20240204060). NANORIBBON STACKS WITHOUT DIELECTRIC PROTECTION CAPS FOR TOP NANORIBBONS simplified abstract
- Intel corporation (20240204091). LOW ALUMINUM CONCENTRATION ALUMINUM GALLIUM NITRIDE INTERLAYER FOR GROUP III-NITRIDE (III-N) DEVICES simplified abstract
- Intel corporation (20240204103). TRANSISTOR GATE-CHANNEL ARRANGEMENTS WITH MULTIPLE DIPOLE MATERIALS simplified abstract
- Intel corporation (20240213118). GALLIUM NITRIDE (GAN) DEVICES WITH THROUGH-SILICON VIAS simplified abstract
- Intel corporation (20240213140). INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE HIGH simplified abstract
- Intel corporation (20240213331). GALLIUM NITRIDE (GAN) LAYER ON SUBSTRATE CARBURIZATION FOR INTEGRATED CIRCUIT TECHNOLOGY simplified abstract
- Intel corporation (20240222376). TECHNOLOGIES FOR RIBBON FIELD EFFECT TRANSISTORS WITH VARIABLE FIN CHANNEL DIMENSIONS simplified abstract
- Intel corporation (20240222440). TRANSISTOR WITH A BODY AND BACK GATE STRUCTURE IN DIFFERENT MATERIAL LAYERS simplified abstract
- Intel corporation (20240222521). TECHNOLOGIES FOR RIBBON FIELD EFFECT TRANSISTORS WITH VARIABLE FIN NUMBERS simplified abstract
- Intel corporation (20240234422). STACKED FORKSHEET TRANSISTORS simplified abstract
- Intel corporation (20240332389). PLUG AND RECESS PROCESS FOR DUAL METAL GATE ON STACKED NANORIBBON DEVICES simplified abstract
- Intel corporation (20240429301). PEROVSKITE-BASED FIELD EFFECT TRANSISTOR (FET) DEVICES ENABLED BY EPITAXIAL LATERAL OVERGROWTH
- Intel corporation (20250072069). RECESSED VIA WITH CONDUCTIVE LINK TO ADJACENT CONTACT
- Intel corporation (20250089312). GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIAL NANOWIRE THICKNESS AND GATE OXIDE THICKNESS
Categories:
- Rachel A. Steinhardt of Beaverton OR (US)
- Kevin P. O'Brien of Portland OR (US)
- Punyashloka Debashis of Hillsboro OR (US)
- Arnab Sen Gupta of Hillsboro OR (US)
- Brandon Holybee of Portland OR (US)
- Raseong Kim of Portland OR (US)
- Matthew V. Metz of Portland OR (US)
- John J. Plombon of Portland OR (US)
- I-Cheng Tung of Hillsboro OR (US)
- Ian Alexander Young of Olympia WA (US)
- Dmitri Evgenievich Nikonov of Beaverton OR (US)
- Dominique A. Adams of Portland OR (US)
- Gauri Auluck of Hillsboro OR (US)
- Pratyush P. Buragohain of Hillsboro OR (US)
- Scott B. Clendenning of Portland OR (US)
- Carly Rogan of North Plains OR (US)
- Tristan A. Tronic of Aloha OR (US)
- Leonard P. Guler of Hillsboro OR (US)
- Hai Li of Portland OR (US)
- Desalegne B. Teweldebrhan of Sherwood OR (US)
- Shengsi Liu of Portland OR (US)
- Saurabh Acharya of Hillsboro OR (US)
- Richard Schenker of Portland OR (US)
- Aryan Navabi-Shirazi of Portland OR (US)
- Michael Babb of Portland OR (US)
- Kai Loon Cheong of Hillsboro OR (US)
- Cheng-Ying Huang of Hillsboro OR (US)
- Mohammad Hasan of Portland OR (US)
- Uygar E. Avci of Portland OR (US)
- Sudarat Lee of Hillsboro OR (US)
- Hojoon Ryu of Hillsboro OR (US)
- Marko Radosavljevic of Portland OR (US)
- Inventors
- Inventors filing patents with Intel Corporation
- Inventors filing patents with INTEL CORPORATION