Category:Saurabh Acharya of Hillsboro OR (US)
Saurabh Acharya
Saurabh Acharya from Hillsboro OR (US) has applied for patents in technology areas such as H01L27/088, H01L29/06, H01L29/423 with intel corporation.
Patents
Subcategories
This category has only the following subcategory.
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Pages in category "Saurabh Acharya of Hillsboro OR (US)"
The following 20 pages are in this category, out of 20 total.
1
- 18125430. SEMICONDUCTOR DEVICES BETWEEN GATE CUTS AND DEEP BACKSIDE VIAS simplified abstract (Intel Corporation)
- 18125440. ISOLATED BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES simplified abstract (Intel Corporation)
- 18125447. GATE LINK ACROSS GATE CUT IN SEMICONDUCTOR DEVICES simplified abstract (Intel Corporation)
- 18125455. BRIDGING CONTACT STRUCTURES simplified abstract (Intel Corporation)
- 18125456. CONTACT EXTENDED OVER AN ADJACENT SOURCE OR DRAIN REGION simplified abstract (Intel Corporation)
- 18455446. RECESSED VIA WITH CONDUCTIVE LINK TO ADJACENT CONTACT (Intel Corporation)
I
- Intel corporation (20240105716). INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORM GRID METAL GATE AND TRENCH CONTACT PLUG simplified abstract
- Intel corporation (20240105774). INTEGRATED CIRCUIT STRUCTURES WITH UNIFORM EPITAXIAL SOURCE OR DRAIN CUT simplified abstract
- Intel corporation (20240105802). INTEGRATED CIRCUIT STRUCTURES HAVING GATE CUT PLUGREMOVED FROM TRENCH CONTACT simplified abstract
- Intel corporation (20240321685). SEMICONDUCTOR DEVICES BETWEEN GATE CUTS AND DEEP BACKSIDE VIAS simplified abstract
- Intel corporation (20240321737). ISOLATED BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES simplified abstract
- Intel corporation (20240321738). BRIDGING CONTACT STRUCTURES simplified abstract
- Intel corporation (20240321872). GATE LINK ACROSS GATE CUT IN SEMICONDUCTOR DEVICES simplified abstract
- Intel corporation (20240321978). CONTACT EXTENDED OVER AN ADJACENT SOURCE OR DRAIN REGION simplified abstract
- Intel corporation (20240355890). CONDUCTIVE BRIDGE THROUGH DIELECTRIC WALL BETWEEN SOURCE OR DRAIN CONTACTS simplified abstract
- Intel corporation (20240355891). CONDUCTIVE BRIDGE THROUGH DIELECTRIC WALL BETWEEN SOURCE OR DRAIN CONTACTS simplified abstract
- Intel corporation (20240355915). BACKSIDE CONDUCTIVE STRUCTURES EXTENDING THROUGH INTEGRATED CIRCUIT TO MEET FRONTSIDE CONTACTS simplified abstract
- Intel corporation (20240429125). INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR ISOLATION
- Intel corporation (20250072069). RECESSED VIA WITH CONDUCTIVE LINK TO ADJACENT CONTACT
- Intel corporation (20250081597). INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORM GRID METAL GATE AND TRENCH CONTACT PLUG