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Category:H05K1/09
Subcategories
This category has the following 18 subcategories, out of 18 total.
A
D
H
I
J
K
M
P
S
T
Y
Pages in category "H05K1/09"
The following 39 pages are in this category, out of 39 total.
1
- 17927576. WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (BOE Technology Group Co., Ltd.)
- 17937894. ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract (Intel Corporation)
- 18138893. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18271871. WIRING BOARD simplified abstract (KYOCERA CORPORATION)
- 18306874. SUBSTRATE INCLUDING A REFERENCE VOLTAGE LAYER HAVING AN IMPEDANCE CALIBRATOR simplified abstract (SK hynix Inc.)
- 18373095. POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES (Intel Corporation)
- 18577077. CIRCUIT BOARD simplified abstract (LG INNOTEK CO., LTD.)
- 18610035. POWER MODULE AND ELECTRICAL DEVICE simplified abstract (BYD COMPANY LIMITED)
- 18623091. WIRING SUBSTRATE simplified abstract (IBIDEN CO., LTD.)
- 18641480. SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Resonac Corporation)
- 18681035. PRINTED WIRING BOARD simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18734089. PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME (Samsung Electro-Mechanics Co., Ltd.)
- 18774603. HYBRID PRINTED CIRCUIT BOARD (Samsung Electronics Co., Ltd.)
- 18796626. RECHARGEABLE BATTERY MODULE (SAMSUNG SDI CO., LTD.)
- 18829690. PRINTED CIRCUIT BOARD (Samsung Electro-Mechanics Co., Ltd.)
- 18848555. PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18967855. CIRCUIT BOARD (LG INNOTEK CO., LTD.)
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on March 21st, 2024
- Blockchain patent applications on March 28th, 2024
- Boe technology group co., ltd. (20240244747). WIRING BOARD, FUNCTIONAL BACKPLANE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Boe technology group co., ltd. (20240260185). CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, FUNCTIONAL BACKPLATE,BACKLIGHT MODULE AND DISPLAY APPARATUS
- Boe technology group co., ltd. (20240260185). CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, FUNCTIONAL BACKPLATE,BACKLIGHT MODULE AND DISPLAY APPARATUS simplified abstract
- BOE TECHNOLOGY GROUP CO., LTD. patent applications on August 1st, 2024
- BOE Technology Group Co., Ltd. patent applications on July 18th, 2024
I
- Intel corporation (20240114627). ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT simplified abstract
- Intel corporation (20250105132). POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on March 27th, 2025
- International business machines corporation (20240431025). CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS
- International Business Machines Corporation patent applications on December 26th, 2024
S
- Samsung electro-mechanics co., ltd. (20250126703). PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Samsung electro-mechanics co., ltd. (20250126707). PRINTED CIRCUIT BOARD
- Samsung Electro-Mechanics Co., Ltd. patent applications on April 17th, 2025
- Samsung electronics co., ltd. (20250089166). HYBRID PRINTED CIRCUIT BOARD
- Samsung Electronics Co., Ltd. patent applications on March 13th, 2025
- Samsung sdi co., ltd. (20250096430). RECHARGEABLE BATTERY MODULE
- SAMSUNG SDI CO., LTD. patent applications on March 20th, 2025